Johnstech International Corporation

Teradyne, Inc.

Other

Sarosh M Patel

David A Johnson

John E Nelson

Michael W Andres

Jeffrey C Sherry

Martin L Culpepper

Brian Warwick

Norman Chow

Michael A Caradonna

Michael Caradonna

Bryan L Clausen, Sr

David Johnson

Harlan Faller

Theodore A Gutfeldt

John Bucher

Rohit Girdhar

Jay Drescher

Theodor A Gutfeldt

A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper () and lower () section and a hinge () in between which allow flex of both upper and lower contact () which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability. It also includes a structure and method for removing upper pinsby use of a modified hinge

On-center electrically conductive pins for integrated testing

A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper () and lower () section and a hinge in between which allow flex of both upper and lower contact () which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability. It also includes a structure and method for removing upper pinsby use of a modified hinge. In an alternate embodiment, the lower section includes a leg extensionand a sliding contact landwhich slides against an aperture in the housing. A spacerprovides space for decoupling components on the load board. The hinge may include a truncated cylinderwhich is configured to permit remove of the upper pin without removal of the lower.

The IC test system provides a system and method for thermal management of test pins. A test pin array () in a pin guide () is mounted in a retainer () which is located between an IC wafer () which contains IC devices to be tested (DUT) and a load board () which provides pathways to test signals to the DUT. On the other side of the load board is a contact plate () which together with the retainer straddles the load board. Leg extensions () pass through the load board apertures () and provide a thermal circuit from the contact plate to the retainer and to the pin array. On the upper side of the contact plate is a cooling/heating system with a thermal electric peltier device () and a further heat exchanger () as needed. Holes () are provided in the legs () to provide a supply of dry air to the wafer and pin array to minimize condensation as a result of cooling effects.

Thermal management for microcircuit testing system

A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper () and lower () section and a hinge () in between which allow flex of both upper and lower contact () which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability.

Articulating contact pin

A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate a first end of the RIM molded encapsulant.

RIM slot filler module and method of manufacturing the same

A probe assembly for use with a calibration/validation robot to calibrate/validate a plurality of semiconductor tester channels is disclosed. The probe assembly includes a bracket adapted for mounting to the robot and a probe element for engaging test points disposed on the semiconductor tester channels. A magnetic attach/release mechanism cooperates with the bracket and probe element to allow for the separation of the probe element from the bracket whenever the probe element meets a force that exceeds a predetermined value.

High fidelity electrical probe

A compliance assembly is disclosed for use in a semiconductor tester testhead stand. The compliance assembly includes an airspring having compliance along a plurality of axes and a containment vessel adapted for receiving the airspring. The containment vessel includes walls that, when the airspring is loaded, control the compliance along the plurality of axes.

Manipulator apparatus with low-cost compliance

A liquid cooling apparatus for use with electronic equipment includes a frame adapted to fit in a chassis with electronic equipment. An inner container and outer container are attached to the frame. A liquid inlet is disposed in the frame and has an opening in liquid flow communication with the inner container. A liquid outlet is disposed in the frame and has an opening in liquid flow communication with the inner container. A vacuum outlet is disposed in the frame and coupled to a space between the inner container and the outer container. A detector is coupled to the vacuum outlet and configured to detect air and/or liquid escaping from the vacuum outlet. Advantages of the invention include the ability to cool electronic equipment while guarding against accidental leaks in the cooling apparatus. The invention is also applicable to any process or system where thermal transfer is needed and leaks are to be protected against. This includes, but is not limited to, heating, cooling, or stabilizing the temperature of chemical, biological, or physical processes in medical, scientific, testing or processing equipment.

Growing community of inventors

Sunnyvale, CA, United States of America

Sarosh M Patel