Silverbrook Research Pty Ltd

Other

Zamtec Limited

Sarkis Minas Keshishian

Kia Silverbrook

Susan Williams

Paul Andrew Papworth

Anthony Michael Vassallo

A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.

Printhead assembly with minimal leakage

A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.

Method of assembling pagewidth printhead

A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20&#xb0; C. less than a second melt temperature of the second adhesive layer.

A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20&#xb0; C. less than a second melt temperature of the second adhesive layer.

Printhead integrated circuit attachment film having differentiated adhesive layers

A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20&#xb0; C. less than a second melt temperature of the second adhesive layer; (b) aligning the film with the ink supply manifold such that each ink supply hole is aligned with a respective ink outlet defined in a manifold bonding surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to an opposite side of the film; (c) aligning the printhead integrated circuits with the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of each printhead integrated circuit; and (d) bonding the printhead integrated circuits to the second adhesive layer.

Method of attaching printhead integrated circuits to an ink manifold using adhesive film

An energy storage device in the form of a cylindrical double layer capacitor (,) includes a plurality of integrally formed first electrode members (,) which each extend between a first end (,) and a second end (,). A plurality of integrally formed second electrode members (,) each extend between a third end (,) and a fourth end (,). As shown, members (,) are interleaved with members (,) such that ends (,) are located intermediate ends (,) of the adjacent members (,). An insulator in the form of carbon layer (,) are disposed between adjacent members (,) to prevent electrical contact therebetween. First contact means in the form of flanges (,) extend from respective ends (,) of each member (,) and electrically connect all the first members. Flanges (,) provide a site for the metallisation of particles thereupon. Those particles form a porous connection layer (,) for an electrical terminal (,) for members (,). Flanges (,) also form a barrier against the ingress of the particles beyond ends (,).

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Balmain, Australia

Sarkis Minas Keshishian