Texas Instruments Corporation

Sarel Bin Ismail

Sueann Lim Wei Fen

Lee Han Meng@ Eugene Lee

Lee Han Meng@Eugene Lee

A method of making an integrated circuit ('IC') device includes forming a lead frame in a lead frame strip. Only portions of the lead frame are plated with a conductor. A die pad is attached to an unplated portion of said lead frame.

Integrated circuit package fabrication

A lead frame device may include an integral die pad member, two separate finger members, a central body portion, each of the finger members have a top and a bottom surface connected by a peripheral edge surface. The lead frame also has a first ear portion, and a second ear portion, each has an ear top surface and an ear bottom surface coplanar with the top surface and bottom surface of the central body portion. The lead frame also has a first longitudinally extending groove and second longitudinally extending groove separate the first ear portion and the second ear portion from the central portion. The first ear portion and the second ear portion each have an abutment surface.

Lead frame with abutment surface

An integrated circuit ('IC') device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.

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Duyong, Malaysia

Sarel Bin Ismail