Seagate Technology Incorporated

Saravuth Keo

Leping Li

Pramit P Parikh

Joel William Hoehn

Roger L Hipwell

Jeff O'Konski

Mark Allen Herendeen

Jeffrey Robert O'Konski

John L Ibele

Edward Alan Knutson

Kara L Maytag

Ralph Marquart

Joe J Schobel

A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.

Work piece contact pad with centering feature

The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Ambient temperature ball bond

Growing community of inventors

Prior Lake, MN, United States of America

Saravuth Keo