Intel Corporation

Sarah M Canny

Kemal Aygun

Joshua Heppner

Jeffory L Smalley

Srikant Nekkanty

Gaurav Chawla

Glen Patrick Gordon

Michael Garcia

Dhanya Athreya

Brian Sackerman

Grace Burleson

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Socket contact techniques and configurations

Generally discussed herein are systems, apparatuses, and methods that relate to an attachment device. According to an example, a device may include an elongated shaft including a top portion, a central portion, and a bottom portion, the central portion between the top portion and the bottom portion, a first fastener in the bottom portion of the shaft, a second fastener in the top portion of the shaft, the second fastener having an adjustable fastening location along the top portion of the shaft, and a spring situated between the first fastener and the second fastener such that a spring force of the spring varies depending on a selected fastening location on the second fastener.

Attachment device

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Hillsboro, OR, United States of America

Sarah M Canny