Avago Technologies International Sales Pte. Limited

Avago Technologies General IP (Singapore) Pte. Ltd.

Wolfspeed, Inc.

Sarah Kay Haney

Brett Hull

Lueder Elbrecht

Daniel Namishia

Li Sun

Chang Kyu Choi

Michael Leary

Chris Chung

Domingo Figueredo

Nitesh Kumbhat

YongIk Choi

Hyun Mo Ku

Ah Ron Lee

Deog Soon Choi

Bernhard Gebauer

Deog-Soon Choi

Jeesu Kim

Ashish Alawani

Marshall Maple

Aaron Lee

Lea-Teng Lee

Dingyou Zhang

Oliver Wiedenmann

Dong Hoon Choi

Myung Soo Kang

The subject technology is directed to systems and methods for integrating inductors within printed circuit boards. In an embodiment, the subject technology provides an apparatus that includes a substrate comprising a first layer and a first inductor coupled to the first layer. The first inductor includes a second layer comprising a first metal material and a third layer comprising a second metal material. The third layer is coupled to the second layer through a first interconnect. The first inductor may be embedded within the substrate to enable efficient space utilization, leading to overall miniaturization and improved performance due to shorter signal paths and reduced parasitic effects. There are other embodiments as well.

Systems and methods for integrating inductors within printed circuit boards

A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Substrate having undercut portion for stress mitigation

A system and method for dissipating heat from a package and reducing interference between signaling pins is disclosed. The system includes a circuit substrate that includes a dielectric layer and at least one metal layer having an external surface. A plurality of metal posts is disposed on the external surface that function to a least one of dissipate heat from the circuit substrate, shield interfering signals between the signaling pins, and interact with mounting substrates on corresponding componentry. One or more metal posts are merged, increasing the interference shielding and heat dissipation functions of the metal posts.

Thermal dissipation and shielding improvement using merged PCB bottom copper post

Stress mitigation structure

An electronic device includes a printed circuit board (PCB) defining a cavity, a first component pad of the PCB positioned outside the cavity, and a second component pad of the PCB positioned on a bottom surface of the cavity. The first component pad has a first thickness, and the second component pad has a second thickness that is less than the first thickness of the first component pad. An electronic component, such as a surface mounted technology (SMT) component, is mounted to the second component pad within the cavity.

Printed circuit board with cavity

Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.

Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module

An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.

Via structures for thermal dissipation

A module includes a printed circuit board (PCB) having a substrate, component pads on a top surface of the substrate, and contact pads formed on a bottom surface of the substrate. The module further includes a mold compound disposed over the PCB; an external shield disposed over a top surface of the mold compound and on side surfaces of the mold compound and the PCB, where the external shield is configured to provide shielding of at least one component connected to at least one component pad from electromagnetic radiation; and a back-spill barrier formed on the bottom of the substrate. The back-spill barrier surrounds the contact pads, and is configured to prevent the external shield from making contact with the contact pads.

Module with external shield and back-spill barrier for protecting contact pads

Growing community of inventors

San Jose, CA, United States of America

Sarah Kay Haney