Sekisui Chemical Co., Ltd.

Saori Ueda

Yasuyuki Yamada

Takeshi Wakiya

Satoshi Haneda

Masao Sasadaira

Mai Yamagami

Hideyuki Takahashi

Minoru Nakajima

Provided is a dimming laminate which can effectively suppress occurrence of color unevenness and light omission. The dimming laminate according to the present invention includes a first transparent base material, a second transparent base material, and a dimming layer disposed between the first transparent base material and the second transparent base material. In this dimming laminate, the dimming layer includes a resin spacer, the resin spacer is a plurality of resin particles, and the resin spacer does not contain resin particles having a particle diameter of 1.4 times or more an average particle diameter of the resin particles or contains 0.0006% or less of the resin particles having a particle diameter of 1.4 times or more the average particle diameter of the resin particles, relative to 100% of the whole number of the resin particles.

Dimming laminate and resin spacer for dimming laminate

Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 &#x3bc;m or more and 15 &#x3bc;m or less, the particles have a 10% K value of exceeding 3000 N/mmand 20000 K/mmor less, and the particles have a particle diameter CV value of 50% or less.

Particles, connecting material and connection structure

A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 &#x3bc;m or more and 300 &#x3bc;m or less, the particles have a 10% K value of exceeding 3000 N/mmand 20000 N/mmor less, and the particles have a particle diameter CV value of 10% or less.

Connecting material and connection structure

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 &#x3bc;m or more and 300 &#x3bc;m or less, the particles have a 10% K value of 30 N/mmor more and 3000 N/mmor less, and the particles have a particle diameter CV value of 10% or less.

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 &#x3bc;m or more and 15 &#x3bc;m or less, the particles have a 10% K value of 30 N/mmor more and 3000 N/mmor less, and the particles have a particle diameter CV value of 50% or less.

Provided is a composition for bonding that forms, after bonding, an adhesive layer that is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test; also provided are an optical adhesive and an adhesive for pressure sensors, both of which comprise the composition. The composition for bonding comprises resin particles. The resin particles have a recovery rate of 20% or less, and a cured product of the composition with a thickness of 250&#xb1;50 &#x3bc;m has a moisture permeability of 90 g/m-24 h or less. An adhesive layer formed from the composition for bonding is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test.

Composition for bonding, optical adhesive, and adhesive for pressure sensor

Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mmor more and 2000 N/mmor less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 &#x3bc;m or more and 200 &#x3bc;m or less.

Adhesive for semiconductor sensor chip mounting, and semiconductor sensor

Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mmor more and 15000 N/mmor less, and the average particle diameter of the spacer being 10 &#x3bc;m or more and 200 &#x3bc;m or less.

Growing community of inventors

Shiga, Japan

Saori Ueda