Denka Company Limited

Saori Inoue

Toshitaka Yamagata

Yoshitaka Minakata

Ryuji Koga

Hideki Hirotsuru

Taiki Nishi

Toshikatsu Mitsunaga

Ryo Yoshimatu

Tomohiro Nomiyama

Ryo Yoshimatsu

Koki Ikarashi

Shuhei Nonaka

Eri Sasaki

Ryoh Yoshimatu

Kouji Miyata

Fumiya Kobayashi

Tomoya Yamaguchi

A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.

Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting same

One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 μm or less.

Composite sheet and method for manufacturing same, and laminate and method for manufacturing same

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

Nitride ceramic resin composite body

A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.

Thermal conductive member and heat dissipation structure including the same

Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.

Heat dissipation structure for electric circuit device

An object of the present invention is to provide a red phosphor, a light emitting element using the phosphor, and a light emitting device using the light emitting element. A phosphor represented by the general formula: CaEuSiAlNin which x+y is 1.0 or more and 1.1 or less, y is 0.004 or more and 0.012 or less, the phosphor being activated with Eu, and some of the Ca element(s) being substituted with the Eu element(s), wherein the phosphor has a lattice constant a of 0.9747 nm or more and 0.9770 nm or less, and a lattice constant c of 0.5050 nm or more and 0.5055 nm or less, and wherein the phosphor has a Ca content of 27.8% by mass or more and 28.8% by mass or less, a dissolved oxygen content in the phosphor of 0.3% by mass or more and 1.2% by mass or less, and an Eu content of 0.4% by mass or more and 1.2% by mass or less.

Phosphor and application therefor

Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 &#x3bc;m and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180&#xb0; C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.

Ceramic resin composite body

A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 &#x3bc;m, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150&#xb0; C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150&#xb0; C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

Growing community of inventors

Omuta, Japan

Saori Inoue