Hitachi, Ltd.

Saori Hamamura

Toshiki Sugawara

Norio Chujo

Naoki Matsushima

Yasunobu Matsuoka

Madoka Minagawa

Satoshi Kaneko

Tsutomu Kono

Koichiro Adachi

In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.

Optical I/O array module and its fabrication method

A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. Optical devicesandare disposed on a circuit board, so that they are optically coupled with optical guidesformed on the circuit board, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film, and an electric wiring layeris laminated, so that the electrodes of the optical devicesand wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing. Also, it has the structure of not causing deterioration of the optical devices due to ill influences of moisture, thereby achieving high reliability. Further, it also produces an easy connecting method with a transmission apparatus, and high productivity thereof.

Photoelectric composite wiring module and method for manufacturing same

A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI (device) having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.

Photoelectric composite wiring module and method for manufacturing the same

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Fujisawa, Japan

Saori Hamamura