Fry's Metals, Inc.

Other

Alpha Assembly Solutions Inc.

Sanyogita Arora

Bawa Singh

Rahul Raut

Siuli Sarkar

Ranjit Pandher

Gerard R Minogue

Anna Lifton

Narahari Pujari

Bin Mo

Michael T Marczi

Ellen Schwartz Tormey

Brian Lewis

Ravindra Mohan Bhatkal

Alvin F Schneider

Steven Dane Prokopiak

Martinus N Finke

Karen A Tellefsen

Ranjit S Pandher

Mitchell Holtzer

A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.

Electrical connection tape

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

Joining to aluminum

Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

Flux formulations

A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Coated solder metal particles

Coating solder metal particles with a charge director medium

A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.

Soldering flux

A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.

Low-residue, low-solder-ball flux

Growing community of inventors

Berkeley Heights, NJ, United States of America

Sanyogita Arora