Intel Corporation

Santosh Shaw

Xiaoqian Li

Jingyi Huang

Wei Li

In one embodiment, photonics die includes one or more opto-electronic elements to receive optical signals and generate electrical signals based on the optical signals and a plurality of v-grooves in a surface of the photonics die and at an edge of the die. Each v-groove is to interface with a fiber optic cable and align the fiber optic cable with an optical interconnect to optically couple the fiber optic cable with the opto-electronic elements. The photonics die also includes a plurality of bonding pads on the surface of the photonics die and electrically connected to the one or more opto-electronic elements, and a plurality of metal bumps coupled to respective bonding pads. The photonics die further includes a barrier formation between the metal bumps and the plurality of v-grooves, e.g., to prevent the overflow of underfill into the v-groove region of the photonics die.

Keep-out zone (KOZ) barriers to prevent epoxy flow into v-groove zone on photonics die

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

Growing community of inventors

Chandler, AZ, United States of America

Santosh Shaw