Microchip Technology Inc.

Santosh Murali

Mel Hymas

Jack Wong

Sajid Kabeer

Brad Kopp

Jim Walls

Methods of fabricating a memory cell of a semiconductor device, e.g., an EEPROM cell, having a sidewall oxide are disclosed. A memory cell structure may be formed including a floating gate and an ONO film over the conductive layer. A sidewall oxide may be formed on a side surface of the floating gate by a process including depositing a thin high temperature oxide (HTO) film on the side surface of the conductive layer, and performing a rapid thermal oxidation (RTO) anneal. The thin HTO film may be deposited before or after performing the RTO anneal. The sidewall oxide formation process may provide an improved memory cell as compared with known prior art techniques, e.g., in terms of endurance and data retention.

Method of forming a polysilicon sidewall oxide region in a memory cell

A method of controlling a resistive memory cell is provided. A resistance threshold value is defined for the memory cell, wherein a circuit identifies the cell as erased if a detected resistance of the cell is above the resistance threshold and identifies the cell as programmed if the detected resistance is below the resistance threshold value. A filament is formed across an electrolyte switching region of the cell by applying an electrical charge, wherein the cell having the formed filament has a first resistance. The cell is then erased to an erased state having a second resistance greater than the first resistance. The cell is then programmed to a quasi-erased state having a third resistance between the first and second resistances, and above the resistance threshold value such that the cell is identified by the circuit as erased. The cell may then be maintained in the quasi-erased state.

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Phoenix, AZ, United States of America

Santosh Murali