Western Digital (Fremont), Inc.

Santi Pumkrachang

Subrata I Gusti Made

Mark D Moravec

Mark Moravec

A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.

Method for manufacturing a read head having conductive filler in insulated hole through substrate

A novel read head includes a substrate having a trailing face and a leading face opposite the trailing face. The substrate includes a first hole therethrough that extends continuously from the trailing face to the leading face. The read head also includes a read transducer disposed on the trailing face, and a first plurality of electrically conductive trailing connection pads disposed on the trailing face. A first insulative layer is disposed on an inner surface of the first hole. A first electrically conductive filler is disposed in the first hole but is insulated from the substrate by the first insulative layer. A first electrically conductive leading connection pad is disposed on the leading face and is electrically connected to the first conductive filler.

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