Intel Corporation

Sankarananda Basak

David W Browning

Akhilesh P Rallabandi

Joshua Een

Disclosed herein are devices, methods, and systems for cooling an electronic component. The cooling device includes a liquid cooling loop with a heat exchanger, wherein the liquid cooling loop thermally conductively connects to the electronic component. The cooling device also includes a vapor compression cooling loop with a compressor and an expansion nozzle. The cooling device also includes an intermediate heat exchanger between the liquid cooling loop and the vapor compression cooling loop for exchanging heat between the liquid cooling loop and the vapor compression cooling loop. The cooling device also includes a controller configured to selectively activate the vapor compression cooling loop based on a power consumption of the electronic component.

Vapor compression assisted liquid cooling system for electronic components

A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.

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Campbell, CA, United States of America

Sankarananda Basak