Intel Corporation

Dell Products Inc.

Sanjoy Kumar Saha

Ioan Sauciuc

Shankar Devasenathipathy

Joseph B Petrini

Hemanth K Dhavaleswarapu

Steven B Roach

Zhihua Li

George S Kostiew

Pranav K Desai

Thoong Hung Seow

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

High performance transient uniform cooling solution for thermal compression bonding process

A system for removing heat from an electronic component associated with an information handling system is disclosed. The system may comprise a mass providing a heat sink to the electronic component and a set of extended surfaces for transferring heat from the mass. The set of extended surfaces may define a primary flow direction for a cooling fluid. A first subset of the set of extended surfaces may have a first length measured in the primary flow direction. A second subset of the set of extended surfaces may have a second length measured in the primary flow direction. Each of the first and second subsets of extended surfaces may include one or more extended surfaces. The second subset of extended surfaces may be generally proximate the hotspot of the electronic component. The second length may be less than the first length such that the flow rate of the cooling fluid through the second subset of extended surfaces is greater than a flow rate of the cooling fluid through the first subset of extended surfaces.

Heat sink including extended surfaces

Growing community of inventors

Chandler, AZ, United States of America

Sanjoy Kumar Saha