Intel Corporation

Avago Technologies General IP (Singapore) Pte. Ltd.

Foxconn Interconnect Technology Limited

Avago Technologies International Sales Pte. Limited

Sanjeev Gupta

Laurence Ray McColloch

Ankur Agrawal

David Meadowcroft

Boping Xie

Israel Petronius

Hui Xu

Jin Hong

Kenneth Brown

Chaitanya Arekar

Ronald L Spreitzer

Jonathan Doylend

Eleanor Patricia Paras Rabadam

Daniel Grodensky

Ron Friedman

Sushrutha Gujjula

Konstantin Matyuch

Gal Dvoretzki

Sam Khalili

Bob Ritter

Nan Kong Ng

Stephen Keele

Guiyun Bai

Qifeng Wu

Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.

Flex-PCB integrated packaging for silicon photonics LiDAR

Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Silicon photonic systems for LIDAR applications

In an optical communications system, the thermal pathway for dissipating heat generated by clock and data recovery (CDR) circuitry of an optical communications module is a separate from the thermal pathway that is used to dissipate heat generated by other components of the module. The CDR circuitry is external to the module and is provided with its own heat dissipation device. Keeping the CDR circuitry external to the module and providing it with its own heat dissipation device decouples the thermal pathway for dissipating heat generated by the CDR circuitry from the thermal pathways used for dissipating heat generated by other components of the module. This results in more effective heat dissipation and better component performance.

Methods and systems for dissipating heat in optical communications modules

A transceiver module includes a printed circuit board and a metal housing enclosing the printed circuit board and defining a front opening, the metal housing including a base portion and a cover portion, the base portion including two opposite side portions, the cover portion including two opposite fixing portions each engaged with a corresponding side portion; wherein each of the side portions defines a gap having an outside opening on an outside wall thereof, each of the fixing portions includes a top portion inwardly extending from a top end thereof, and the top portion is inserted in a corresponding gap.

Transceiver module having improved metal housing for EMI containment

An optical communications module is provided with an EMI shielding system that comprises a resistive coating disposed on one or more inner surfaces of the module housing. The resistive coating has a thickness that is greater than or equal to one skin depth and has a resistivity that is low enough to support electrical current flow, but high enough to absorb EMI radiation of a particular wavelength or wavelength range. The combination of these features causes EMI radiation to propagate in the resistive coating due to skin effect. The resistive coating absorbs at least a portion of the EMI radiation propagating therein.

Method and system for providing electromagnetic interference (EMI) shielding in an optical communications module

Growing community of inventors

Santa Rosa, CA, United States of America

Sanjeev Gupta