Verigy (singapore) Pte. Ltd.

Adv Antest Corporation

Advantest (singapore) Pte Ltd

Sanjeev Grover

John William Andberg

Stephen Bellato

Todd Sholl

Benson Morris

Ira Leventhal

Erik H Volkerink

Lakshmikanth Namburi

Yohannes Desta

Noriyuki Sugihara

Matthew W Losey

Kenneth D Karklin

Donald W Chiu

Vincent E Lopopolo

Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel 'split-cartridge' design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A 'probe-card stops' design may be used within the cartridge to simplify the overall cartridge design and operation.

Method and apparatus for massively parallel multi-wafer test

In one embodiment, a test system has a set of test electronics for testing a device under test (DUT). The test system also has at least one test electronics to DUT interface having a zero insertion force (ZIF) connector. Each ZIF connector has a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.

Test electronics to device under test interfaces, and methods and apparatus using same

There is disclosed apparatus for routing signals between at least one PCB within a test head and a socket card assembly. In an embodiment, the apparatus may include at least one flexible circuit electrically connecting first and second sides of the PCB and the socket card assembly with one another, and the flexible circuit having a defined shape configured to interface with the socket card assembly and the PCB along substantially perpendicular planes. Methods of routing signals between at least one PCB within a test head and a socket card assembly are disclosed. In one embodiment, a method may include electrically connecting first and second sides of the PCB and the socket card assembly with one another with at least one flexible circuit having a defined shape configured to interface with the socket card assembly and the PCB along substantially perpendicular planes. Other embodiments are also disclosed.

System, method and apparatus using at least one flex circuit to connect a printed circuit board and a socket card assembly that are oriented at a right angle to one another

A screw-less latching system for securing load boards comprises a frame and a backer plate. The frame includes a loading site for a device under test. The loading site includes a first tee clamp disposed along a first longitudinal axis and a second tee clamp disposed along a second longitudinal axis of the loading site. The loading site further includes a first spring plunger disposed along a first lateral axis of the loading site. The backer plate is configured to attach the device under test. The backer plate includes two lock tabs coupling with the first and second tee clamps. The backer plate further includes a first recess coupling with the first spring plunger.

Screw-less latching system for securing load boards

Growing community of inventors

San Jose, CA, United States of America

Sanjeev Grover