Crestron Electronics, Inc.

Lucent Technologies Inc.

Andrew Corporation

Commscope, Inc. of North Carolina

Sanjay Sudhaker Upasani

Albert Pedoeem

Suresh Goyal

George Feldstein

Wendy Feldstein

Pratod V Kasbekar

William P Rehak

Harish S Mangrulkar

Dhirendra Patel

John Edward Clarke

Alec J Magrini

Richard William Brown

Michael John Nuttall

John Henry Schaffeld

Mark A Biasotti

Susan L Tuttle

William Cowles

Charles J Buondelmonte

Richard Franklin Schwartz

Michael L Moroze

Kriss Replogle

Kian-Mun Kong

Don Florczak

King Woo Cheung

Dhirendra M Patel

Joseph P Mendelsohn

Scott Allen Bergman

Sebsibe Kebede

Min Li

An apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are in an upper portion of a first panel that faces a first direction. Air exhaust holes are in an upper portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

Apparatus for cooling electronic circuitry

Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

A touch screen device includes an electric power receptacle configured for being spill resistant. The electric power receptacle provides a fluidly isolated environment for each contact thereby allowing the electric power receptacle to pass a dielectric withstand test.

Electric power receptacle

Two-button keypad

An interconnection element for coupling a component with a circuit board having a top side and a bottom side has a planar portion configured to be surface mounted on the top side of the circuit board to overlie an opening in the circuit board. An opening is formed in the planar portion to coincide with the circuit board opening. Opposing spring fingers are coupled to the planar portion, and each spring finger has a gripping leg extending downwardly toward the planar portion. The gripping legs are positioned on opposite sides of the opening in the planar portion and extend through the opening in the planar portion to extend into the board opening and capture a component lead that extends in the board opening from the bottom side of the circuit board.

Bottom entry interconnection element for connecting components to a circuit board

A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Interconnection pin/socket components for electrically connecting two circuit boards and method for mounting said components in a circuit board

Microphone sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a microphone having terminal pins electrically connected within the tubular housing to leads extending through the housing tubular wall. The leads provide contact springs for spring biased contact with conductive lands on the substrate. In one embodiment, the contact springs comprise coiled springs and, in another embodiment, the contact springs comprise leaf springs terminating in arcuate cam surfaces.

Spring biased microphone sub-assemblies

In a battery pack made up of battery cells encased within a housing made up of a stronger outer housing portion and a weaker inner housing portion, the battery cells are secured to the stronger outer housing portion. Advantageously, the relative motion between the battery cells and the stronger of the housing portions that results when prior art battery packs are dropped, and which causes catastrophic failure of the prior art battery packs, is prevented. The battery cells may be secured to the stronger outer housing portion, for example, by gluing the battery cells to the stronger housing portion, attaching the battery cells to the stronger housing portion by using double-sided sticky tape, molding features into the stronger housing portion that immobilize the battery cells adjacent to the stronger housing portion, or providing screw holes through the stronger housing portion so that screws may engage the battery cell or an appendage thereto.

Droppable battery packs

Acoustic component sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a component having terminal pins electrically connected within the tubular housing to coil springs extending outwardly through an open end of the tubular housing. The coil springs serve as component terminals for spring biased contact with conductive lands on the substrate. The tubular housing is press fitted within a seat on the substrate and contacted by the handset outer housing for being tightly clamped within the substrate seat.

Impact-tolerant mounting of acoustic components

Portable telephone handset

Growing community of inventors

Manalapan, NJ, United States of America

Sanjay Sudhaker Upasani