Intel Corporation

Sanjay Gupta

Koushik Banerjee

John F McMahon

Barbara Jane Ultis

An electronic package which contains discrete resistive and capacitive components used to control the operating device of an integrated circuit located within the package. The package has a bonding shelf that has a plurality of bond fingers which are connected to the integrated circuit. The discrete passive components are mounted to the bonding shelf and connected to the bond fingers by lead traces. The lead traces terminate at the discrete devices so that the resistor and capacitor cannot be accessed through the external contacts of the package. The integrated circuit and discrete components are typically enclosed by a molded plastic material to prevent physical access to the devices without damaging the package.

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Tempe, AZ, United States of America

Sanjay Gupta