Northrop Grumman Systems Corporation

Sanjay B Moghe

Gregory R Dietz

Howard N Fudem

Richard R Becker

A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.

Adaptable MMIC array

A frequency stable oscillating device includes an oscillating transistor. A heating element is disposed in close proximity to the oscillating transistor. A temperature sensor is mounted in close proximity to the oscillating transistor. A temperature control device supplies a variable signal which is dependant upon a local temperature of the oscillating transistor, wherein the variable signal controls the operation of the heating element. The heating element may alternately consist of one or more resistive patches, or one or more heating transistors which are biased to provide sufficient heating. The oscillating device may be formed from either IC or MMIC technologies, and may be formed from either silicon or GaAs.

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Hoffman Estates, IL, United States of America

Sanjay B Moghe