Inpria Corporation

Samsung Electronics Co., Ltd.

Sangyoon Woo

Jason K Stowers

Brian J Cardineau

Chawon Koh

Tsunehiro Nishi

Soo Young Choi

Alan J Telecky

Michael K Kocsis

Peter De Schepper

Multiple patterning approaches using radiation sensitive organometallic materials is described. In particular, multiple patterning approaches can be used to provide distinct multiple patterns of organometallic material on a hardmask or other substrate through a sequential approach that leads to a final pattern. The multiple patterning approach may proceed via sequential lithography steps with multiple organometallic layers and may involve a hardbake freezing after development of each pattern. Use of an organometallic resist with dual tone properties to perform pattern cutting and multiple patterning of a single organometallic layer are described. Corresponding structures are also described.

Multiple patterning with organometallic photopatternable layers with intermediate freeze steps

Provided herein are photoresist compositions and methods for fabricating semiconductor devices using the same. A photoresist composition may include an organometallic material, a fluorine-containing material, and an organic solvent.

Photoresist compositions and methods for fabricating semiconductor devices using the same

Growing community of inventors

Leuven, Belgium

Sangyoon Woo