Samsung Electronics Co., Ltd.

Sangyeop Baeck

Inhak Lee

Taehyung Kim

Seunghun Lee

Hyejin Lee

Chanho Lee

SangShin Han

Kyuwon Choi

Dongwook Seo

Hoyoung Tang

Suk Youn

Seunghan Park

Jungmyung Kang

Bonyeop Kim

A memory device includes a bit cell array including a plurality of bit cells connected to a first auxiliary line to which a cell power voltage is supplied; a write driver configured to apply a bit line voltage corresponding to write data to a bit line extending in a column direction of the bit cell array during a write operation; and a write auxiliary circuit connected to the first auxiliary line and a second auxiliary line extending in parallel to the first auxiliary line, and configured to lower a cell power voltage for a first bit cell spaced apart from the write driver during the write operation, wherein the cell power voltage is supplied to the first auxiliary line through the second auxiliary line, and in sequence from the first bit cell to a second bit cell adjacent to the write driver through the first auxiliary line.

Memory device

A semiconductor device includes a substrate including a first memory cell, a second memory cell adjacent to the first memory cell in a first direction, and a comparator circuit adjacent to the first and second memory cells in a second direction intersecting the first direction; a true bit line and a complementary bit line electrically connected to the first and second memory cells and extending in the first direction from a first wiring layer on the substrate; a first power supply wiring on the first wiring layer, extending in the first direction between the true bit line and the complementary bit line and electrically connected to the first and second memory cells; first and second word lines extending in the second direction from a second wiring layer on the substrate different from the first wiring layer; first word line pads on the first wiring layer and electrically connecting the first memory cell to the first word line; second word line pads on the first wiring layer and electrically connecting the second memory cell to the second word line; and a first ground pad on the first wiring layer, electrically connected to the first and second memory cells, and in a same position as one of the first word line pads and one of the second word line pads in the second direction.

Semiconductor device

An integrated circuit includes: a memory cell block including a plurality of bitcells; and an input and output (I/O) block including a plurality of gate-all-around (GAA) transistors connected to the bitcells, wherein the I/O block includes a plurality of active regions disposed separately from one another in a first direction, each of which extends in a second direction that is vertical to the first direction, and in which the GAA transistors are formed, a plurality of power rails disposed separately from one another in the first direction, and configured to provide power to the GAA transistors, and a plurality of signal lines disposed between the power rails, and configured to provide signals to the GAA transistors, a first number of bitcells among the bitcells are connected to the GAA transistors formed in a second number of active regions among the active regions, and the second number is twice the first number.

Integrated circuit including gate-all-around transistor

An integrated circuit includes: a first wiring layer on which a first bit line pattern and a positive power supply pattern, a first power supply line landing pad, and a first word line landing pad are formed; a second wiring layer on which a first negative power supply pattern connected to the first power supply line landing pad, and a first word line pattern connected to the first word line landing pad are formed; a third wiring layer on which a second negative power supply pattern connected to the first negative power supply pattern, and a second word line landing pad connected to the first word line pattern are formed; and a fourth wiring layer on which a second word line pattern, connected to the second word line landing pad, are formed.

Integrated circuit including memory cell and method of designing the same

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Sangyeop Baeck