Epack, Inc.

Other

Bliley Technologies, Inc.

Shinsung Soundmotion Co., Ltd.

Sangwoo Lee

Jay Mitchell

Anthony Challoner

Jinho Kim

Onnop Srivannavit

Kyudong Jung

A method of manufacturing a plurality of neural probes from a silicon wafer in which after neural probes are formed on one side of a silicon wafer, the other side of the silicon wafter is subject to a dicing process that separates and adjusts the thickness of the neural probes.

Method for manufacturing implantable electrodes and electrodes made by such methods

The present invention relates to a MEMS acoustic sensor for sensing variable capacitance between a flexible diaphragm and a back plate. The MEMS acoustic sensor is composed of a substrate comprising a cavity, a back plate supported on the substrate and comprising a plurality of through holes, an electrode formed on the inner surface of the back plate, at least one anchor protruding from the back plate toward the substrate, a diaphragm supported by the at least one anchor and deformed by a sound wave introduced from the outside through the cavity, and a stress release unit extending from the edge portion of the back plate and in contact with the substrate.

MEMS acoustic sensor

Motion and/or orientation sensing systems can utilize gyroscopes, accelerometers, magnetometers, and other sensors for measuring motion or orientation of connected objects. Temperature changes affect the precision of the data output by the motion/orientation sensing device. A system is provided for controllably heating a device within a package to a desired temperature that varies based on the ambient temperature. The operating temperature of the device can then be known and controlled. The ambient temperature can be known through an ambient temperature sensor, for example. Given this information, a controller compensates the data output by the device to further improve the accuracy in the measurements. Like the amount of heating provided to the package, the amount of compensation is also based on the ambient temperature and/or the device temperature.

System with oven control and compensation for detecting motion and/or orientation

A microelectromechanical vibration and stress isolation system is provided. The system includes an isolation platform configured to support a transducer and having an outer perimeter. A frame surrounds the isolation platform and has inner edge surfaces that are spaced from and face the outer edge surfaces of the platform. A spring connects the isolation platform to the frame. The spring is generally L-shaped, having a first leg that connects one inner edge surface to an outer edge surface while extending around a corner of the platform.

Growing community of inventors

Ann Arbor, MI, United States of America

Sangwoo Lee