Samsung Electronics Co., Ltd.

Yonsei University

Sungkyunkwan University

Sangwon Park

Sangwan Nam

Bongsoon Lim

Yonghyuk Choi

Jaeduk Yu

Younsun Kim

Hyoungju Ji

Yohan Lee

Jichang Kang

Jinsook Park

Seungwook Suh

Chungyong Lee

Euikyun Koh

Seongju Kim

Juho Lee

Hyojin Lee

Daeseok Byeon

Yoonhee Choi

Sangwon Shim

Jiyeon Shin

Hoondong Noh

Jinkyu Kang

Byungsoo Kim

Jaeduk Lee

Junho Choi

Jinhwan Kim

Jooyong Park

Chaehoon Kim

Kuihan Ko

Jiho Cho

Sanggeun Lee

Ilgyu Choi

Dongjin Shin

Raeyoung Lee

Seungyong Choi

Minyong Kim

Sanggi Hong

Soo-Jung Kang

Jae Min Jeong

Jekyung Choi

Guyeon Han

Suchang Jeon

Ilkyu Choi

Hoondong Nho

Washing machine

A non-volatile memory device includes a meta area having a first region storing first initial data, and second regions storing second initial data, different from each other; a user area configured to store user data; an initialization register configured to store the first initial data or update the second initial data in whole or in part; and control logic configured to perform a read operation, a program operation, or an erase operation using the initial data stored in the initialization register.

Non-volatile memory device, storage device including the same, and operating method thereof

In a method of operating a nonvolatile memory device that includes a memory block including cell strings where each of the cell strings includes a string selection transistor, memory cells and a ground selection transistor which are connected in series and disposed in a vertical direction, each of word-lines coupled to the memory cells is set up to a respective target level during a word-line set-up period, a sensing operation on target memory cells is performed by applying a read voltage to a selected word-line coupled to the target memory cells while applying a read pass voltage to unselected word-lines during a sensing period, and while consuming an internal voltage connected to the unselected word-lines in a particular circuit in the nonvolatile memory device, a voltage level of the unselected word-lines is recovered to a level of the internal voltage during a discharge period of a word-line recovery period.

Nonvolatile memory device preventing overshoot of internal voltage and method of operating nonvolatile memory device

A non-volatile memory device includes a plurality of word lines stacked above a substrate in a vertical direction; erase control lines that are spaced apart from each other in a first direction and extend in a second direction; a pass transistor circuit including a first pass transistor connected to a first group of erase control lines and a second pass transistor connected to a second group of erase control lines; and a memory cell array including a plurality of blocks. The first group of erase control lines are relatively close to a word line cut region and the second group of erase control lines are relatively far from the word line cut region. Each of the plurality of blocks includes a plurality of channel structures connected to the word lines and the erase control lines and each channel structure extends in the vertical direction.

Non-volatile memory device

A non-volatile memory device is provided. The memory device includes: word lines stacked on a substrate; a string select lines on the word lines, the string select lines being spaced apart from each other in a first horizontal direction and extending in a second horizontal direction; and a memory cell array including memory blocks, each of which includes memory cells connected to the word lines and the string select lines. The string select lines include a first string select line, and a second string select line which is farther from a word line cut region than the first string select line, and a program operation performed on second memory cells connected to a selected word line and the second string select line is performed before a program operation performed on first memory cells connected to the selected word line and the first string select line.

Provided are a memory device storing setting data and a memory system including the same. The memory device may include a cell array including a plurality of cell blocks, each including a plurality of pages, and a control logic that controls a program and read operation on the cell array, wherein at least one page of the cell array stores information data read (IDR) data including information related to a setting operation of the memory device, at least one other page of the cell array stores replica IDR data including inverted bit values of the IDR data, and the control logic controls a recovery operation for repairing errors in the IDR data by reading the replica IDR data when a read fail of the IDR data occurs.

Memory device and operating method for setting and repairing data errors

Provided is a non-volatile memory device including a memory cell array including cell strings each including memory cells and a string select transistor connected to a string select line; a page buffer circuit including page buffers each including a forcing latch configured to store forcing information; and a control logic circuit configured to, during a program operation on a selected word line, control at least two of a first voltage applied to the string select line in a first interval before a bit line forcing operation for transferring the forcing information to the selected cell string, a second voltage applied to the string select line in a second interval in which the bit line forcing operation is performed, and a third voltage applied to the string select line in a third interval after the bit line forcing operation is performed, to be different from each other.

A memory device includes a first memory area including a first memory cell array having a plurality of first memory cells and a first peripheral circuit disposed below the first memory cell array; a second memory area including a second memory cell array having a plurality of second memory cells and a second peripheral circuit disposed below the second memory cell array; and a pad area including a power wiring. The first and second memory areas respectively include first and second local lockout circuits separately determining whether to lock out of each of the memory areas. The first and second memory areas are included in a single semiconductor chip to share the pad area, and the first and second memory areas operate individually. Accordingly, in the memory device, unnecessary data loss may be reduced by selectively stopping an operation of only a memory area requiring recovery.

Memory device

A nonvolatile memory device includes a first semiconductor layer, a second semiconductor layer and a control circuit. The memory cell array includes a first vertical structure on the first upper substrate and a second vertical structure on the second upper substrate, the first vertical structure includes first sub-blocks and the second vertical structure includes second sub-blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The first vertical structure includes first via areas in which one or more through-hole vias are provided, through-hole vias pass through the first vertical structure. The first sub-blocks are arranged among the first via areas and the second sub-blocks are arranged among the second via areas. The control circuit groups the memory blocks into a plurality of groups based on whether the memory blocks is close to the first via areas and performs address re-mapping.

Nonvolatile memory device having cell-over-periphery (COP) structure with address re-mapping

A nonvolatile memory device includes a first semiconductor layer including an upper substrate in which word-lines extending in a first direction and bit-lines extending in a second direction are disposed and a memory cell array, a second semiconductor layer, a control circuit, and a pad region. The memory cell array includes a vertical structure on the upper substrate, and the vertical structure includes memory blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The vertical structure includes via areas in which one or more through-hole vias are provided, and the via areas are spaced apart in the second direction. The memory cell array includes mats corresponding to different bit-lines of the bit-lines. At least two of the mats include a different number of the via areas according to a distance from the pad region in the first direction.

Nonvolatile memory device

The present disclosure relates to a copolyester including a polymer formed by polymerization of monomers represented by the following Structural Formula 1 to Structural Formula 4: 

Copolyester including cyclic aliphatic unit, method of preparing the same, and optical film with low water absorption and low birefringence including the same

A memory device includes a cell area including memory blocks, and a peripheral circuit area including peripheral circuits that execute an erase operation for each of the memory blocks. Each memory block includes word lines that are stacked on a substrate, channel structures penetrate through the word lines, and a source region that is disposed on the substrate and connected to the channel structures. During the erase operation in which an erase voltage is provided to the source region of a target memory block among the memory blocks, the peripheral circuits reduce a voltage of a first word line from a first bias voltage to a second bias voltage at a first time, and to reduce a voltage of a second word line, different from the first word line, from a third bias voltage to a fourth bias voltage at a second time different from the first time.

A nonvolatile memory device includes memory cell region including a first metal pad and a peripheral circuit region including a second metal pad, is connected to the memory cell region by the first metal pad and the second metal pad and includes including an address decoder and a page buffer circuit located on a first substrate. A memory cell array is provided in the memory cell region, which includes a first vertical structure on a second substrate. The first vertical structure includes first sub-blocks and first via areas in which one or more through-hole vias are provided, and through-hole vias pass through the first vertical structure. A control circuit in the peripheral circuit region groups the memory blocks into a plurality of groups based on whether the memory blocks is close to the first via areas and performs address re-mapping.

Nonvolatile memory device with address re-mapping

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Seoul, South Korea

Sangwon Park