Samsung Electronics Co., Ltd.

Sangung An

Hyunsuk Choi

Junseok Kim

Hosoon Lee

Juree Kim

Jongcheol Jang

A method of forming a transparent member according to an embodiment may include: a process of putting a first transparent substrate and a second transparent substrate into a first cavity of a lower mold that has a first depth and a second cavity of a lower mold that is connected to the first cavity and has a second depth, respectively; a process of disposing an upper mold, which corresponds to the lower mold and includes a pressing portion having at least one pressing surface, on an upper portion of the lower mold; a process of preheating at least one of the lower mold in which the transparent substrates are disposed or the upper mold to a predetermined temperature; and a process of thermoforming the preheated transparent substrates by pressing the preheated transparent substrates in a manner of pressing the upper mold. Various other embodiments identified through the specification are possible.

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Gyeonggi-do, South Korea

Sangung An