Samsung Electronics Co., Ltd.

Sanguk Kim

Hyoseok Na

Jongdoo Kim

Wanjae Ju

Joosung Kim

Daeseung Park

Taekho Lee

Dongyoung Kim

Yonghwan Kwon

Donghwan Kim

Taegyu Kim

Joonsung Kim

Hanyeop Lee

Gun Lim

Wonsub Lim

Un Jeong Kim

Taihwan Choi

Doil Ku

Yohan Moon

Donghyun Yoo

Sangsoon Kim

Yongsub Lee

Kyungbae Ko

Younggil Gi

Younghak Park

Yonghee Yang

Youngsub Lee

Minjoo Hwang

An electronic device includes a display; a conductive plate supporting the display; a bracket including a surface and a structure at least partially removed from the surface, wherein the surface faces toward the conductive plate and is spaced apart from the conductive plate; a connecting member crossing the structure along the surface and connecting the conductive plate and the bracket, the connecting member including a first conductive portion and a second conductive portion; and a conductive tape between the connecting member and the bracket, wherein the first conductive portion overlaps with the structure when viewed from a first direction toward the display and is at least partially inserted into the structure, at least part of the first conductive portion contacts the conductive plate, and the second conductive portion extends from the first conductive portion along a surface of the bracket and has an end attached to the bracket through the conductive tape.

Electronic device including connecting member of internal structure

An electronic device includes a flexible display configured to be rollable; at least one camera; and a processor operatively connected to the flexible display and the camera, wherein the processor is configured to: detect operation initiation of the camera; identify a rolling state of the flexible display, based on the operation initiation; rotate the camera toward a designated direction, based on the rolling state of the flexible display; and based on the rolling state of the flexible display, display an image obtained from the designated direction via the camera in a center of the flexible display.

Electronic device having flexible display, and camera module control method therefor

According to an embodiment, an electronic device may comprise an antenna circuit including an antenna, a first capacitor, a switch, a sensor, and at least one processor. The at least one processor may be configured to control the switch to connect the first capacitor and the sensor, based on start of booting of the electronic device, determine an initial value of the sensor for determining whether a user grips at least a portion of the electronic device, based on the connection of the first capacitor and the sensor, and control the switch to connect the antenna circuit and the sensor, based on the determination of the initial value of the sensor. Other various embodiments are possible as well.

Electronic device including sensor and method for operating the same

A semiconductor package includes a package substrate, first and second bumps on a lower surface of the package substrate, a semiconductor chip on an upper surface of the package substrate, first and second connection patterns on the upper surface of the package substrate, a molding on the upper surface of the package substrate and covering the semiconductor chip, a warpage control layer on the molding, an upper insulating layer on the warpage control layer, a first opening passing through the upper insulating layer and exposing an upper surface of the warpage control layer, a second opening overlapping the first opening in a top view, the second opening passing through the warpage control layer and exposing the first connection pattern, and a third opening passing through the upper insulating layer and exposing the second connection pattern.

Semiconductor package

An electronic device is provided. The electronic device includes a first mechanical element, a second mechanical element moving with respect to the first mechanical element, a frame including a first frame formed of a conductive material and coupled to the first mechanical element and a second frame formed of a conductive material and coupled to the second mechanical element, a segmentation part formed at the frame to segment each of the first frame and the second frame into a plurality of parts, and a first substrate member which includes a first part and a second part spaced apart from each other, and a first bending part for bendably connecting the first part and the second part and is disposed to move together with at least one of the first mechanical element and the second mechanical element, wherein a plurality of wires arranged at the first substrate member may be arranged not to pass through a first area which is an area of the first bending part of the first substrate member and is adjacent to the segmentation part.

Electronic device including circuit board placed adjacent to frame made of conductive material

Disclosed is an electronic device is provided. The electronic device includes a first substrate, a second substrate arranged to be spaced apart from the first substrate, a first cable electrically connecting a first point on the first substrate and a second point on the second substrate, and a second cable electrically connecting a third point on the first substrate and a fourth point on the second substrate. The first substrate may include a first communication circuit, a second communication circuit, a detection circuit, a voltage application unit, and a ground unit, and a second substrate may include a first antenna, a first capacitive element, a second antenna, a second capacitive element, and an isolation circuit. The isolation circuit may isolate a radio frequency (RF) signal between the first path and the second path, and electrically connect the detection circuit to the ground unit through the first cable and the second cable.

Detection circuit and electronic device including same

A semiconductor package is provided. The semiconductor package includes a chip pad of a semiconductor chip, the chip pad including a connection portion and a test portion in a first surface of the chip pad; a barrier layer covering the chip pad, the barrier layer defining a first opening and a second opening that is separate from the first opening, the first opening exposing the connection portion of the chip pad, and the second opening exposing the test portion of the chip pad; and a redistribution structure.

Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad

According to various embodiments of the disclosure, an electronic device may comprise: a housing including: a first surface, a second surface facing in a direction opposite to the first surface, and a side surface at least partially surrounding a space between the first surface and the second surface; a printed circuit board disposed between the first surface and the second surface; a first sensing element including a plurality of conductive vias arranged in parallel to the side surface in at least a portion of an edge of the printed circuit board; and a grip sensor electrically connected with the first sensing element. The grip sensor may be configured to detect a change in capacitance due to an approach or contact state of an external object to the housing, in at least a portion of the side surface of the housing using the first sensing element.

Electronic device including grip sensor

An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.

Wide-band antenna and electronic device including the same

A packaged integrated circuit device includes a frame having a cavity therein and an inner semiconductor chip within the cavity. A lower re-distribution layer is provided, which extends adjacent lower surfaces of the frame and the inner semiconductor chip. The lower re-distribution layer has an opening therein which at least partially exposes the lower surface of the inner semiconductor chip. A lower semiconductor chip is provided, which extends adjacent the lower surface of the inner semiconductor chip, and within the opening in the lower re-distribution layer. This lower re-distribution layer includes: (i) an insulating layer covering the lower surface of the frame, (ii) a re-distribution pattern disposed on the insulating layer, and (iii) a barrier layer, which is disposed on the insulating layer and surrounds at least a portion of the lower semiconductor chip.

Semiconductor package with barrier layer

A semiconductor package including a lower redistribution layer including wiring patterns; a lower substrate on the lower redistribution layer, the lower substrate including a cavity; an application processor on the lower redistribution layer in the cavity; a cache memory chip on the application processor; a passive device module on the application processor; a plurality of first through-silicon vias penetrating the application processor to connect the lower redistribution layer to the passive device module; and lower bumps on a bottom surface of the lower redistribution layer, wherein the passive device module is adjacent to a side of the cache memory chip.

Passive device module and semiconductor package including the same

An electronic device and a grip recognition method for reducing the SAR of the electronic device are provided. The electronic device of the present disclosure includes an antenna, a coupler, a processor electrically coupled to the antenna and the coupler, and a memory electrically coupled to the processor. The memory stores instructions that, when executed by the processor, cause the processor to detect a change of a transmit power value using the coupler during transmission of a radio signal through the antenna. The instructions further cause the processor to determine whether the electronic device is being gripped based on the change of the transmit power value.

Electronic device and grip recognition method thereof

Various embodiments of the present invention relate to an electronic device including an antenna impedance matching circuit. The electronic device may comprise: at least one interface; at least one detection circuit for detecting a connection of at least one external device to the at least one interface; at least two matching circuits; an antenna; and a switch module for receiving, from the at least one detection circuit, at least one signal corresponding to whether the at least one external device is connected to the at least one interface, and for connecting the antenna to a matching circuit, among the at least two matching circuits, corresponding to the at least one signal. Various other embodiments are also possible.

Growing community of inventors

Gyeonggi-do, South Korea

Sanguk Kim