Samsung Electronics Co., Ltd.

Sangsoo Yu

Jeongmin Park

Sehoon Kim

Hyunsuk Jang

Raehong Cho

Heewoo Lee

An apparatus with a housing having a structure for heat dissipation is provided. The apparatus includes the housing having at least one surface, outer walls, and a plurality of fins, and an operating unit fixed to the housing, wherein the at least one surface of the housing includes a fin cover connected to the fins, a base exposed in an internal space in which the operating unit is disposed, and a refrigerant filled in a space between the fin cover and the base, wherein the fin cover and the base are connected through the outer walls, and wherein the fin cover has a flat surface.

Apparatus with housing having structure for radiating heat

A communication device enclosure is made of different materials. The communication device enclosure includes a first housing, a second housing, and a connector cover. The first housing is formed in a box shape and has one open face and one open lateral face adjacent to the one open face. The second housing is formed in a box shape and has one open face and one open lateral face adjacent to the one open face. The first and second housings form together an inner space for containing an electronic component. The connector cover is formed of a material different from materials of the first and second housings, is disposed on the open lateral faces of the first and second housings, and has a connector for electric connection between the electronic component and an external device. The connector cover is combined with the first and second housings to seal the inner space.

Growing community of inventors

Suwon-si, South Korea

Sangsoo Yu