Samsung Electronics Co., Ltd.

American Messaging Services, LLC

Lg Electronics Inc.

Other

Samsung Display Co., Ltd.

Sungkyunkwan University

New Power Plasma Co., Ltd.

Sangsoo Kim

J Roy Pottle

John F Nagel

Peter C Barnett

David Andersen

Jongho Park

Yongkwan Lee

Jamie Gordon Nichol

Seung Hwan Kim

Hyunki Kim

Junyoung Oh

Seunghwan Kim

Jongho Lee

Jun Young Oh

Kyong Hwan Koh

Dong-Ju Jang

Kyung Suk Oh

Kyungsuk Oh

Junwoo Park

Sung-Kyu Park

Seungkon Mok

Insik Jang

Namdeog Kim

Pilsung Choi

Jeongha Sohn

Hyungtaek Kim

Sehun Ahn

Changyoung Yoo

Youngmin Lee

Daesung Kim

Yeonhwa Lee

Jiyoung Choung

Joongu Lee

Duckjung Lee

Seungeun Lee

Jeongyun Heo

Changkyu Choi

Sehoon Jeong

Kihyun Park

Jungbin Lee

Minsoo Park

Jihye Ham

Jungjoo Kim

Pyoungwan Kim

Daewook Kim

Jiwon Shin

Donguk Kwon

WooRam Myung

Byungseong Bae

Boeun Jang

Insup Shin

Taewha Choi

Minyong Jung

Kyonghwan Koh

Jungsun Lee

Yun-Young Kim

Bonjoon Koo

Bae Byungseong

Jamie Gordon Nlchol

Kwangsu Shin

Myron D Anduri

Dave Anderson

Jaeyoun Shin

Jinkyu An

You Seung Soh

Yongseok Seo

Seokyeon Hwang

Jaeho Kwak

Wonpil Lee

Bongkuk Hong

A semiconductor package includes: a lower substrate including a lower wiring layer; a semiconductor chip disposed on the lower substrate, the semiconductor chip including a first surface facing the lower substrate and a second surface opposite to the first surface; an upper substrate disposed on the lower substrate and the semiconductor chip, the upper substrate including a lower surface on which support members protruding toward the second surface of the semiconductor chip are disposed; a connection structure disposed between the lower substrate and the upper substrate; an encapsulant filling a space between the lower substrate and the upper substrate and encapsulating at least a portion of the semiconductor chip and the connection structure; and adhesive members disposed on the second surface of the semiconductor chip such as to correspond to the support members, respectively, the adhesive members disposed in contact with the second surface and the support members.

Semiconductor package

A semiconductor package includes a package substrate including a base substrate including a redistribution layer, pads disposed on first and second surfaces of the base substrate and connected to the redistribution layer, and a protective layer having a mounting region in which first openings respectively exposing first pads among the pads and a second opening exposing second pads among the pads and a portion of the second surface are disposed on the second surface; a semiconductor chip disposed on the mounting region and connected to the pads through the first openings and the second opening; and a sealing material covering a portion of the semiconductor chip and extending into the second opening. Four first openings among the first openings are respectively disposed adjacent to respective corners of the mounting region. The second opening is disposed to divide the four first openings into at least two groups.

Package substrate and semiconductor package including the same

An electronic messaging device includes a receiver configured to receive a message at one of a first operational frequency and second operational frequency. The messaging device can operate using a time synchronous protocol and can receive commands through over-the-internet-programming (OTIP) and over-the-air-programming (OTAP).

Messaging devices and methods

A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

Semiconductor package and a method of fabricating the same

An electronic messaging device includes a receiver configured to receive a message at one of a first operational frequency and second operational frequency. The messaging device can added to a message distribution group comprising a plurality of existing messaging devices. A test communication can be sent through a coupling to test an operation of the messaging device and confirming the addition of the messaging device to the message distribution group without communicating with the existing messaging devices.

A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.

Apparatus for conducting plasma surface treatment, board treatment system having the same

A semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface. A semiconductor chip is on the first surface of the substrate. A passive element is on the second surface of the substrate. The substrate includes a first passive element pad and a second passive element pad that are exposed by the second surface. A dam extends downwardly from the second surface. The dam includes a first dam and a second dam. The passive element is disposed between the first dam and the second dam. The passive element includes a first electrode portion electrically connected to the first passive element pad. A second electrode portion is electrically connected to the second passive element pad.

A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.

Methods of manufacturing semiconductor package and package-on-package

Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.

Semiconductor package for discharging heat generated by semiconductor chip

Growing community of inventors

Seoul, South Korea

Sangsoo Kim