Samsung Electronics Co., Ltd.

Sangsik Na

Changsu Kim

Hangyu Hwang

Jongbae Jeon

Hyunjung Jung

Pranveer Singh Rathore

Rathore Pranveer Singh

Ingook Hong

Jinho Kim

Minwoo Yoo

Yongseok Lee

Jinho Lim

Sungho Cho

Hongbum Park

Sooyoung Kim

Youngjin Yi

Donghyeon Hwang

Yeonghwan Gong

Youngik Son

Jinhyeong Park

Hyeonseok Yoon

Heekwang Lim

Hyosang Lim

Taehwan Kang

Jinshik Lim

Junpil Kim

Jungho Hwang

Dukjin Kim

Jongyoul Noh

A portable electronic device is provided. The portable electronic device includes a metal housing, an antenna module positioned in the metal housing, a first injection-molded member positioned in a radiation direction of the antenna module and having a first dielectric constant, a second injection-molded member at least partially in contact with the first injection-molded member, positioned in the radiation direction of the antenna module, and having a second dielectric constant different from the first dielectric constant, and a first organic film disposed along an inner surface of the metal housing to bond with at least a portion of the first injection-molded member, wherein the second injection-molded member forms, together with the metal housing, an exterior of the portable electronic device, and wherein the second injection-molded member is coupled with the first injection-molded member through a coupling structure in which one of the first injection-molded member or the second injection-molded member is at least partially protruding into another one of the first injection-molded member or the second injection-molded member.

Electronic device including antenna module

According to certain embodiments, an electronic device housing comprises: a substrate including: a front surface comprising a plurality of front surface protrusions and a plurality of taper protrusions protruding from the plurality of front surface protrusions and a rear surface comprising a plurality of rear surface protrusions; and wherein two protrusions selected from the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions are different from each remaining ones of the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions; a deposition layer formed on the front surface of the substrate; and a transparent coating layer formed on the rear surface of the substrate.

Electronic device housing with protrusions and electronic device including the same

Disclosed is a portable communication device including a housing, a printed circuit board seated in the housing and mounted to a communication circuit, and a least one position adjusting groove, wherein the housing includes a support plate having at least one antenna unit operatively connected with the communication circuit, and an injection molded member surrounding at least a portion of the at least one antenna unit, wherein the support plate includes a main body in which at least a portion of the printed circuit board is seated, and at least one lead connecting the at least one antenna unit with the main body, and wherein the at least one position adjusting groove is formed at a position at which the at least one lead makes contact with the injection molded member.

Support plate and portable communication device including the same

An electronic device is provided. The electronic device includes a housing; and a coating layer formed on at least a portion of a surface of the housing, wherein the coating layer comprises a paint, the paint including a one-component acrylate-based paint having a property of being cured by an ultraviolet (UV) light, or a one-component or two-component paint containing acryl and urethane and having a property of being cured by heat, wherein the coating layer has a pattern structure including an uneven pattern through laser processing on a portion of a coating film formed by applying the paint, and wherein two or more regions having different glossiness may exist on the surface of the housing by the pattern structure of the coating layer.

Electronic device including housing and method for manufacturing the housing

A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.

Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same

An electronic device according to various embodiments of the present disclosure includes a housing including a front plate facing a first direction, a rear plate facing a second direction that is opposite to the first direction, and side members for encompassing the inner space between the front plate and the rear plate; a display shown through at least a portion of the front plate; and a middle plate positioned between the front plate and the rear plate. The middle plate can include a first portion disposed between the front plate and the side members, when viewed from the outside of the housing. The first portion can include: a first surface supporting a portion of the front plate and facing the first direction; a second surface exposed to the outside of the housing; a third surface facing a third direction that is different from the first direction and the second direction, and facing the side surface of the front plate; and a protruding part protruding in the third direction on the third surface.

Electronic device including injection structure, and injection mold structure for injection structure

A cover device according to an embodiment of the present invention, may include a first plate including a first surface and a second surface facing away from the first surface, and being substantially rectangular, the first plate including a first edge having a first length and extending in a first direction, a second edge having a second length longer than the first length and extending in a second direction orthogonal to the first direction, a third edge parallel to the first edge, having the first length, and extending in the first direction from the second edge, and a fourth edge parallel to the second edge, having the second length, and extending from the first edge in the second direction, a first sidewall perpendicular to the first surface and extending from the first edge, a second sidewall perpendicular to the first surface and the first sidewall and extending from the second edge, a third sidewall perpendicular to the first surface and the second sidewall and extending from the third edge, and a fourth sidewall perpendicular to the first surface and the third sidewall and extending from the fourth edge, wherein the first surface, the first sidewall, the second sidewall, the third sidewall and the fourth sidewall together may form a recess for receiving and holding the electronic device, and the first surface may include at least one parting line having a third length longer than the first length and shorter than the second length and extending in the second direction.

Cover device for holding electronic device

An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing in a direction opposite to that of the first plate, and a side member enclosing a space between the first plate and the second plate and formed with a method of solidifying a resin including a predetermined amount of rigidity reinforcing material injected into an injection mold and including a plurality of side surfaces, and a gate mark receiving portion formed in each of the plurality of side surfaces of the side member and configured to receive at least one gate mark according to separation of the injection mold. The gate mark receiving portion is formed by a processing portion disposed at a corresponding position inside a cavity of the injection mold.

Housing, method of producing the same, and electronic device including the same

Growing community of inventors

Suwon-si, South Korea

Sangsik Na