Samsung Electronics Co., Ltd.

Sangmoo Park

Doyoung Kwag

Minsub Oh

Yoonsuk Lee

Eunhye Kim

Byungchul Kim

Dongyeob Lee

Seona Yang

Wonsik Choi

Seungryong Han

Jamyeong Koo

Hyunsun Kim

Youngkyong Jo

Masaru Wada

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

Display module and method for manufacturing display module

An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.

Electronic device including LED transmission device, and control method therefor

A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.

Display apparatus

A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.

Display module comprising side wirings and large format display apparatus using the same

A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.

Micro LED transfer method and display module manufactured by the same

A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.

Display module and method of manufacturing the same

A light emitting diode (LED) transfer system includes an alignment apparatus configured to align a plurality of target substrates; a handling robot configured to transport the plurality of target substrates; a transfer stage configured to hold the plurality of target substrates and move the plurality of target substrates; a substrate stage configured to move a relay substrate having a plurality of LEDs with respect to the transfer stage while the plurality of LEDs are facing the transfer stage; a laser configured to emit a laser beam toward the plurality of LEDs of the relay substrate so that the plurality of LEDs are transferred from the relay substrate to the plurality of target substrates; and a processor configured to control the alignment apparatus, the handling robot, the transfer stage, the substrate stage, and the laser to transfer the plurality of LEDs of the relay substrate to the plurality of target substrates.

Light emitting diode transfer system and control method thereof

A method of manufacturing a display apparatus includes performing a first repair process of detecting a first defective light emitting diode (LED) from among a plurality of LEDs provided on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to electrode patterns of an interposer substrate and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process of detecting a second defective LED among the plurality of LEDs attached to the electrode patterns and replacing the second defective LED.

Manufacturing method of display apparatus, interposer substrate, and computer program stored in readable medium

A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

Micro LED transfer device and micro LED transferring method using the same

A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.

Micro LED transferring method and display module manufactured by the same

A compression bonding apparatus is disclosed. The compression bonding apparatus comprises: a stage configured to support a substrate on which a plurality of light emitting elements are arranged on an adhesive layer having a predetermined viscosity; a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and a pressing member configured to press the plurality of light emitting elements, wherein the support member is configured to have a height equal to or greater than the height of the substrate.

Compression bonding apparatus

A micro LED transferring method is provided. The transferring method includes selectively applying a color conversion material to a mono-color substrate, the mono-color substrate including first micro LEDs in a first color; obtaining a multi-color substrate based on a result of the applying, the multi-color substrate including the first micro LEDs in the first color and second micro LEDs in a second color different from the first color; and irradiating a laser beam toward the multi-color substrate to transfer the first micro LEDs and the second micro LEDs to a target substrate.

Display module manufactured by micro LED transferring method

A display module is provided. The display module includes a substrate including a thin film transistor (TFT) layer including a plurality of TFTs, a plurality of light emitting diodes (LEDs) arranged on a front surface of the substrate, each LED corresponding to a respective TFT, and an operation driver that is connected to a rear surface of the substrate and controls an operation of the TFTs. The substrate includes a plurality of first via holes extending in a vertical direction from the front surface of the substrate to the rear surface of the substrate. The first via holes are filled with conductive materials and are distributively arranged based on at least one of the columns or rows of the plurality of LEDs. The first via holes connect the TFTs to the operation driver.

Display module and display apparatus having the same

A method of manufacturing a micro light emitting diode (LED) display and a transfer apparatus are provided. The method of manufacturing a micro LED display includes: identifying a repairing micro LED, from among a plurality of second micro LEDs, on a second substrate based on a first position of a defective micro LED, from among a plurality of first micro LEDs, on a first substrate; removing the defective micro LED from the first substrate; matching the first position on the first substrate from which the defective micro LED has been removed to a second position of the repairing micro LED on the second substrate; and transferring the repairing micro LED from the second position on the second substrate to the first position on the first substrate from which the defective micro LED has been removed, by using a laser transfer method.

Transfer apparatus and method of manufacturing micro LED display using the same

A display panel and a method of manufacturing thereof are provided. The method of manufacturing a display panel includes forming a driving circuit on a substrate; forming an electrode, including a first area and a second area therewith, on the driving circuit; mounting a first micro Light Emitting Diode (LED), for forming a sub pixel, on the first area; forming an absorption layer on the second area, the absorption layer configured to absorb an external light; removing, based on the sub pixel being defective, the absorption layer; and mounting a second micro LED on the second area after removing the absorption layer.

Growing community of inventors

Suwon-si, South Korea

Sangmoo Park