Samsung Electronics Co., Ltd.

Stats Chippac Pte. Ltd.

Sangmi Park

Jaehwan Kim

Junghun Kim

YoungJoon Kim

YongHyuk Jeong

Yongjoon Jeon

Dongwoo Kim

Jinwoo Lee

Bokun Choi

Jongmu Choi

Yongseok Park

Hyunho Park

Jisup Lee

Dongeup Ham

Jupyo Hong

In an authentication method according to an embodiment, an electronic device receives an authentication request message based on identification information from a server apparatus. In response to the authentication request message, the electronic device receives at least one of an input for authentication approval of a specific device and an input for authentication approval of a service offered through the specific device. Then, in response to the input, the electronic device transmits authentication approval information to the server apparatus.

Method for authentication and electronic device supporting the same

Disclosed is an electronic device including a processor that receives an input signal for requesting an authentication, determines whether a mobile oriented (MO) server is available based on at least one of an international mobile subscriber identity (IMSI) or network Internet Protocol (IP) information of the electronic device, and if it is determined that the MO server is available, creates an authentication code, and a communication module that transmits the created authentication code to the MO server.

Method for processing authentication, electronic device and server for supporting the same

Disclosed herein are a method and device for transmitting digital content. A selection of at least one device authorized to receive digital content is detected. It is identified whether each selected device contains a session key that corresponds to a local session key. Digital content is transmitted to each device whose session key corresponds to the local key. Digital content is prevented from transmission to unselected devices not having a corresponding session key.

Transmission of digital content to select devices

A semiconductor device has a first conductive layer formed over a first substrate. A second conductive layer is formed over a second substrate. A first semiconductor die is mounted to the first substrate and electrically connected to the first conductive layer. A second semiconductor die is mounted to the second substrate and electrically connected to the second conductive layer. The first semiconductor die is mounted over the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and the first and second substrates. A conductive interconnect structure is formed through the encapsulant to electrically connect the first and second semiconductor die to the second surface of the semiconductor device. Forming the conductive interconnect structure includes forming a plurality of conductive vias through the encapsulant and the first substrate outside a footprint of the first and second semiconductor die.

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

Growing community of inventors

Gyeonggi-do, South Korea

Sangmi Park