Samsung Electronics Co., Ltd.

Lg Electronics Inc.

Sangman Lee

Byungwoon Jung

Youngbae Kwon

Ki-Chul Park

Changwon Yun

Junghyeong Ha

Hyungwoo Kim

Jina Park

Young Min Kang

A mobile terminal is provided that includes a main body in which a structure is mounted, an antenna coil formed to be wound along edges of the structure to receive a change in magnetic flux in a vicinity of the main body, an electronic element disposed to be adjacent to the structure, and a ferrite sheet configured to remove noise with respect to reception of the change in the magnetic flux and disposed on one surface of the electronic element such that a distance is formed between the ferrite sheet and the antenna coil.

Mobile terminal

Disclosed is a method of fabricating a semiconductor chip. The method includes forming a silicon layer; forming a first layer formed on the silicon layer and including a first seal ring surrounding a first chip area and a second seal ring surrounding a second chip area; and forming a second layer formed on the first layer and including a metal interconnection connecting one of the first and second chip areas and an external terminal.

Semiconductor chip including a plurality of chip areas and fabricating method thereof

Growing community of inventors

Seoul, South Korea

Sangman Lee