Lg Electronics Inc.

Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Other

Kia Corporation

Sangkyu Lee

Inbo Shim

Bohyun Nam

Sojin Park

Seunghyun Song

Jihoon Sung

Woochan Jun

Jingu Kim

Yongkoon Lee

Jeongho Lee

Shanghoon Seo

Seokkyu Choi

Jung Hwan Lee

Jae Young Choi

Seong Jae Choi

Myungsam Kang

Hyeon Jin Shin

Seon Mi Yoon

Sangjo Kim

Young Chan Byun

Changhwa Sun

Kyungdon Mun

Ungyu Paik

Bum Jae Lee

Tae Woo Kim

Sang Don Lee

Sangsoo Lee

Jong-Chul Choi

Chang-Ryong Heo

Jae-Hoon Choi

Doohwan Lee

Min-Woo Yoo

Hyungkyu Youk

Jeongbin Yim

Dongsub Kim

Yoojin Jung

Taesung Jeong

Gongje Lee

JeongHo Lee

Daewoong Han

Min-Jong Lim

Seulki Lee

Kwangmin Gil

Li-Yeon Kang

Jinkeun Park

Jaehwa Jeon

Sela Lim

Wonseok Jin

A semiconductor package according to an example embodiment of the disclosure includes a first redistribution layer including a first via, a first redistribution pattern, and a first insulating layer, a first semiconductor chip connected to the first redistribution layer via a chip connection terminal, a lower post directly connected to the first redistribution layer, an upper post connected to an upper surface of the lower post, a first mold layer at least partially covering the first redistribution layer, the first semiconductor chip, the lower post, and the upper post, and a second redistribution layer on the upper post and the first mold layer. The upper post has a width that gradually increases as the upper post extends from the lower post toward the second redistribution layer. An upper surface of the upper post is coplanar with an upper surface of the first mold layer.

Semiconductor package including post

A semiconductor device includes a substrate having a recess region, a first electrode in the recess region and having a three-dimensional network structure, a first dielectric layer in the recess region and covering the first electrode, a second electrode in the recess region and covering the first dielectric layer, and a molding layer filling a remaining portion of the recess region and covering the second electrode.

Semiconductor device and semiconductor package including the same

A cleaner includes a cleaner main body, and a suction unit connected to the cleaner main body to suck air containing dust, and provided with a brush assembly brought into contact with a floor, wherein the brush assembly includes a rotating rod rotatable in one direction, a brush portion protruding from an outer circumferential surface of the rotating rod to rotate together with the rotating rod, and a blade erected at the rear of the brush portion in the one direction to be adjacent to the brush portion, and brought into contact with the brush portion during the rotation in the one direction, to prevent foreign substances from getting tangled in the brush portion. This configuration may prevent foreign substances such as hair and the like from being tangled in the brush portion during an operation of the cleaner.

Cleaner

An integrated power supply includes a first low voltage DC-DC converter (LDC) that converts supply power to a first output voltage and provides the first output voltage to a first auxiliary battery and a first electric load connected to each other in parallel; a second LDC that converts the supply power to a second output voltage and provides the first output voltage to a second auxiliary battery and a second electric load connected to each other in parallel; and an integrated controller that controls the first LDC and the second LDC to change output voltages of the first LDC and the second LDC. The first auxiliary battery and the second auxiliary battery are connected in series, and when the first LDC fails, the second LDC outputs a second increase output voltage that is higher than the second output voltage under control of the integrated controller.

Integrated power supply of vehicle and control method thereof

A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

Semiconductor package including antenna

A semiconductor package includes a support member, a semiconductor chip arranged in the support member such that a front surface and a backside surface of the semiconductor chip are exposed from a second surface of the support member and a first surface opposite to the second surface respectively, a lower redistribution wiring layer covering the second surface of the support member and including first redistribution wirings electrically connected to chip pads provided at the front surface of the semiconductor chip and vertical connection structures of the support member respectively, and an upper redistribution wiring layer covering the first surface of the support substrate, and including second redistribution wirings electrically connected to the vertical connection structures and a thermal pattern provided on the exposed backside surface of the semiconductor chip.

Semiconductor package and method of manufacturing the semiconductor package

A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.

Semiconductor package including heat spreader layer

A battery charging apparatus and method for a vehicle are provided. The charging apparatus for the vehicle includes a third switching element provided between a first battery and a second battery, configured to electrically connect or disconnect the first battery and the second battery; a first switching element configured to supply or cut off a charging current supplied from outside to the first battery; a second switching element configured to supply or cut off the charging current supplied from the outside to the second battery; and a controller configured to control the first switching element, the second switching element, and the third switching element in order to selectively charge at least one of the first battery or the second battery.

Battery charging apparatus and method for vehicle

A semiconductor package includes: a frame substrate having a plurality of wiring layers and a cavity; an adhesive member disposed at the bottom of the cavity; a semiconductor chip disposed in the cavity, with a connection pad on an upper surface and the lower surface in contact with the adhesive member; a first conductive bump disposed on the connection pad; a second conductive bump disposed on the uppermost of the plurality of wiring layers; an insulating post disposed in the cavity and whose lower surface contacts the adhesive member; an encapsulant filling the cavity and covering side surfaces of the first and second conductive bumps and the insulating post' and a redistribution structure disposed on the encapsulant, including a redistribution layer electrically connected to the first and second conductive bumps, wherein the insulating post includes a material having a greater hardness than that of the first and second conductive bumps.

Semiconductor package

A semiconductor package is disclosed. The semiconductor package includes a back-side wiring substrate and a front-side redistribution layer which are in parallel, and a connector, a semiconductor chip and an encapsulator which are between the back-side wiring substrate and the front-side redistribution layer. The encapsulator surrounds surfaces of the connector and the semiconductor chip. The back-side wiring substrate includes a core layer, a back-side via plug extending through the core layer, and a back-side redistribution layer on the back-side via plug.

Method of manufacturing a semiconductor package

A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

Semiconductor package with an antenna substrate

According to an aspect of the present invention, a method for producing an oxide-dispersed strengthened alloy using organic-inorganic kneaded composition is provided. The method, comprises: a feedstock preparing step of preparing the organic-inorganic kneaded composition prepared by kneading, pulverizing and granulating ODS mixed powders and a polymer binder; a molding step of forming a semi-finished product having a predetermined shape using the organic-inorganic kneaded composition; a debinding step of removing the polymeric binder from the semi-finished product molded in the molding step; and a sintering step of extracting a final product having a predetermined shape by sintering and cooling the semi-finished product in which the polymeric binder has been removed in the debinding step.

Method for manufacturing oxide dispersion strengthened alloy using organic/inorganic mixed composition as raw material

A robot cleaner comprising: a cleaner body including a controller, the cleaner body having a dust container accommodation part formed therein; a wheel unit mounted in the cleaner body, the wheel unit of which driving is controlled by the controller; and a dust container detachably coupled to the dust container accommodation part, wherein a first opening and a second opening are disposed at the same height in an inner wall of the dust container accommodation part, wherein the dust container includes: an entrance and an exit, disposed side by side along the circumference of the dust container, the entrance and the exit, respectively communicating with the first opening and the second opening when the dust container is accommodated in the dust container accommodation part; and a flow separating part extending downwardly inclined along the inner circumference of the dust container.

Autonomous cleaner

Growing community of inventors

Seoul, South Korea

Sangkyu Lee