Samsung Electronics Co., Ltd.

Lg Display Co., Ltd.

Sanghyun Kwon

Han Bit Kim

Chan Young Park

Doowon Seo

Choonkeun Lee

Hyungkyu Kim

Seungon Kang

Heungju Jo

Seongchan Park

Jeongkweon Park

Euijun Lee

Yongbeom Jeong

A semiconductor package includes: a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface; a heat-dissipating member disposed on the inactive surface of the semiconductor chip and including graphite; an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member; a capping metal layer disposed directly between the heat-dissipating member and the encapsulant; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the heat-dissipating member includes holes passing through at least a portion of the heat-dissipating member, and the holes overlap the inactive surface of the semiconductor chip.

Semiconductor package

Growing community of inventors

Suwon-si, South Korea

Sanghyun Kwon