Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Lg Electronics Inc.

Yonsei University

Doosan Heavy Industries & Construction Co., Ltd

Samsung Sdi Co., Inc.

Sungkyunkwan University

Lg Display Co., Ltd.

Alcatel-lucent USA Inc.

Naver Corporation

Kookmin University

Hanlab Corporation

Bass Co., Ltd.

Sanghoon Lee

Hangil Moon

Myunggil Kang

Taehun Kim

Seungmin Lee

Donghan Kim

Jonghyun Choi

Kisoo Kim

Hyunwook Kim

Jeongil Kang

Taehoon Yang

Kinyeng Kang

Kyungtae Kim

Seungmin Song

Sunggil Kim

Taewoo Kim

Youngil Kim

Seung-Won Park

Chang-Hyun Cho

Hyuekjae Lee

Subhojit Chakladar

Hojae Lee

Jongho Lee

Seunghwan Cho

Seulye Kim

Sunghyup Kim

Woocheol Shin

Jihoon Kim

Jong-Hyung Kwun

Joonsuk Lee

Nohyun Kwag

Kyehoon Lee

Sangheon Yoon

Sung-Hyun Cho

Jungho Lee

Woong Seop Lee

Krishna Bhuwalka

Sangcheon Park

Gapsu Shin

Yeonjin Jo

Taeyoung Kim

Dongwon Kim

Yung-Soo Kim

Jungshin Park

Tae-Jin Lee

Doosuk Kang

Bokun Choi

Chan-yul Kim

Sun-il Lee

Yangwook Kim

Un-Byoung Kang

Hyun Jung Kim

Sangsoo Lee

Woong Hee Lee

Eunha Choi

Jiwon Kim

Jongmin Lee

Ki Nyeng Kang

Hyun Kyung Kim

Jin Hee Kim

Seong-Yong Hwang

Kwang Tai Kim

Ji-Hoon Choi

Gupil Cheong

Chungsun Lee

Jinkyu Kim

Eun-Seok Ko

Youngji Kim

Yunjong Yeo

Cheol-Woo You

Kyunghoon Kim

Taejun Kim

Unbyoung Kang

Young-Hyun Jeon

Jaeyoung Ahn

Hyunmin Hwang

Byung-Seo Yoon

Youngseok Lee

Kyoungho Bang

Jaehong Park

Byungwook Kim

Daehwan Jang

Jigwang Kim

Jung Eun Hong

Injae Lee

Christine Irene Podilchuk

Woosung Lee

Minseong Yi

Dongyoon Kim

Chulhwan Lee

Hyungbin Cho

Hyunggil Baek

Sangsoo Park

Sang Cheon Park

Chanyoung Park

Byung-Sung Kim

Jintae Noh

HongSuk Kim

Seokwon Ji

A semiconductor device including a lower structure, an upper pattern, a stacked structure, a separation structure passing through the stacked structure, a vertical structure comprising a channel layer, wherein the stacked structure comprises a plurality of interlayer insulating layers and a plurality of gate layers, the lower structure comprises a first lower pattern and a second lower pattern of a material different from a material of the first lower pattern, the first lower pattern comprises a first portion between the second lower pattern and the channel layer, a second portion extending from the first portion to a region between the second lower pattern and the upper pattern, and a third portion extending from the first portion to a region between the second lower pattern and the substrate structure, and the first lower pattern does not extend toward a side surface of the upper pattern.

Three-dimensional semiconductor memory device

An image processing device is provided. The image processing device includes: an image quality enhancement circuit configured to generate second image data indicating a plurality of pixel values corresponding to a quadrangular shape by performing image quality enhancement processing on first image data; a map decoder configured to read a map, which includes a plurality of pixel adjustment values for adjusting brightness of a first region of the second image data corresponding to a curved edge of a display panel, from a memory and provide alpha values indicated by the map; a processing circuit configured to generate third image data by adjusting the brightness of the first region by applying the alpha values to the second image data; and a transmission circuit configured to output the third image data to a display driving integrated circuit.

Image processing device, operating method thereof, and display system including image processing device

A display device may include a substrate including a first area and a second area surrounding the first area, and pixel circuits disposed on the substrate. The pixel circuits may include a first pixel circuit disposed in the first area and a second pixel circuit disposed in the first area. The display device may include display elements disposed on the substrate. The display elements may include a first display element that may be disposed in the first area and electrically connected to the first pixel circuit and a second display element that may be disposed in the second area and electrically connected to the second pixel circuit. Various embodiments are disclosed.

Display device including display elements and pixel circuits disposed in different areas

An electronic device includes a memory configured to store computer-executable instructions; and a processor configured to execute the computer-executable instructions to: based on a result of analyzing a transmission environment of a wireless communication channel through which an audio signal is transmitted, determine a bitrate of the audio signal, encode the audio signal into packets according to the bitrate, the packets including a main packet for audio streaming and a plurality of extension packets for sound quality improvement, based on at least one of a type of the packets and the result of analyzing the transmission environment, determine a packet type indicating a modulation scheme and number of time slots used for transmitting each packet of the packets, and configure and transmit audio packets reflecting the packet type for each packet of the packets.

Electronic device for performing audio streaming and operating method thereof

An electronic device includes a memory, a processor, and a communication interface configured to transmit audio packets to at least one sink device where the processor may determine bit rates of the audio packets based on at least one of a wireless transmission environment in which the audio packets are transmitted or a type of each of the audio packets, encode a broadcasting audio signal to the audio packets based on the bit rates of the audio packets, and repeatedly transmit the audio packets a predetermined number of times to the at least one sink device through a broadcasting channel.

Electronic device and sink device for transmitting and receiving audio packet, and operating methods thereof

Disclosed is an electronic device including: a first authentication module configured to determine whether a driver corresponds to a valid user of a vehicle, according to an artificial intelligence (AI)-based authentication process, a control module configured to select a low-speed authentication process or a high-speed authentication process based on a speed of the vehicle, based on determining through the AI-based authentication process that the driver does not correspond to the valid user, and a second authentication module configured to determine whether the driver corresponds to the valid user, according to the authentication process selected by the control module, wherein the AI-based authentication process is configured to be performed based on a neural network configured to process sensing data collected by a sensor of at least one of the vehicle or a mobile device of the driver while the driver is using the vehicle.

Electronic device and vehicle driver authentication method by the electronic device

A semiconductor device includes a substrate including a first device region and a second device region, active regions spaced apart from each other on the substrate, having a constant width, extending in a first direction parallel to an upper surface of the substrate and including a first active region and a second active region provided on the first device region and a third active region and a fourth active region provided on the second device region, a plurality of channel layers provided on the active regions and configured to be spaced apart from each other in a direction perpendicular to the upper surface of the substrate, gate structures provided on the substrate and extending to cross the active regions and the plurality of channel layers, and source/drain regions provided on the active regions on at least one side of the gate structures.

Semiconductor device

The electronic apparatus including a power factor correction (PFC) circuit and a control circuit configured to control an operation of the PFC circuit is provided. The PFC circuit includes a first inductor part connected to one end of an AC voltage part and a first switch connected to a first inductor in series; a second inductor part connected to another end of the AC voltage part and a second switch connected to a second inductor in series; an output part connected to the first inductor part and the second inductor part; and a switching part, and the control circuit identically applies a switch on/off signal to the first switch and the second switch, and selectively applies a switch on/off signal to the third switch or the fourth switch based on a magnitude of an input voltage input through the AC voltage part.

Electronic apparatus and control method thereof

Provided are an electronic device mounted on a vehicle and an operating method of the electronic device. An electronic device, according to an embodiment of the disclosure, obtains a surrounding environment image by using a camera, detects at least one object from the surrounding environment image by using an artificial intelligence (AI) model, receives a vehicle to everything (V2X) data set including information about the at least one object, selects a first object in the detected at least one object by a user input, obtains information about a type of the first object by using a detection result determined based on the surrounding environment image and the received V2X data set, and displays a user interface (UI) for wireless communication connection with the first object, based on the information about the type of the first object.

Electronic device mounted on vehicle and operating method of the electronic device to receive information about proximate objects

A semiconductor package includes a first semiconductor chip including a first semiconductor substrate, and a plurality of first through electrodes penetrating at least a portion of the first semiconductor substrate. A plurality of second semiconductors include a second semiconductor substrate, the plurality of second semiconductor chips being stacked on the first semiconductor chip. A plurality of bonding pads are arranged between the first semiconductor chip and the plurality of second semiconductor chips. A chip bonding insulating layer is arranged between the first semiconductor chip and the plurality of second semiconductor chips. At least one supporting dummy substrate is stacked on the plurality of second semiconductor chips and having a support bonding insulating layer arranged on a lower surface thereof.

Semiconductor package

An electronic device comprising: a power supply apparatus including a first converter configured to generate driving power and a second converter configured to generate first standby voltage and second standby voltage; and a main body operated based on the driving power and the second standby power received from the power supply apparatus. The second converter is configured to: during a normal mode operation and a standby mode operation, obtain the first standby voltage and adjust the first standby power based on the obtained standby power; and during the standby mode operation, obtain the second standby voltage; and in response to the obtained second standby voltage being equal to or less than a reference level, perform the normal mode operation to control the first standby voltage to be maintained at a first voltage level and control the second standby voltage to be maintained at a second voltage level.

Power supply device and electronic device comprising same

A semiconductor package includes a first connection structure, a first semiconductor chip on an upper surface of the first connection structure, a first molding layer on the upper surface of the first connection structure and surrounding the first semiconductor chip, a first bond pad on the first semiconductor chip, a first bond insulation layer on the first semiconductor chip and the first molding layer and surrounding the first bond pad, a second bond pad directly contacting the first bond pad, a second bond insulation layer surrounding the second bond pad; and a second semiconductor chip on the second bond pad and the second bond insulation layer.

Packaged multi-chip semiconductor devices and methods of fabricating same

An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.

Apparatus and method of manufacturing solder bump

A display device includes: a bending area between a first area and a second area; a substrate having a first opening, at least a portion of the first opening corresponding to the bending area; a display layer on a first surface of the substrate in the first area; an encapsulation member on the display layer; a first organic material layer on the substrate to cover the first opening of the substrate; and a wiring layer on the first organic material layer and comprising a plurality of wires extending in a direction crossing the bending area.

Display device

An electronic device and a method are provided for recording audio data acquired from multiple devices. The electronic device includes a microphone, a communication module, a memory, and a processor configured to establish a first communication link with a first external electronic device through the communication module, establish a second communication link with a second external electronic device through the communication module, acquire a microphone input signal by operating the microphone based on receiving a recording request from the first external electronic device, monitor a transmission environment with the communication module or the second external electronic device, determine a bit rate of audio, based on the transmission environment, encode the audio, based on the determined bit rate, and transmit the encoded audio data to the first external electronic device.

Electronic device and method for recording audio data acquired from multiple devices

Growing community of inventors

Seoul, South Korea

Sanghoon Lee