Samsung Electronics Co., Ltd.

Sangbong Park

Kwang Soo Kim

Byeonghwan Jeon

Sung-Won Park

Janghee Lee

Youngduk Kim

Jeong-Su Ha

Yoo Jin Jeong

Byeong Kyu Cha

An inspection apparatus includes a light source device providing incident light to a substrate, an objective lens receiving reflection light reflected from the substrate, a light splitting device disposed over the objective lens, first and second optical sensors disposed at both sides of the light splitting device, respectively, and first and second spatial filters disposed between the first optical sensor and the substrate and between the second optical sensor and the substrate, respectively. The first and second spatial filters transmit the reflection light in different forms from each other.

Inspection apparatus, semiconductor device manufacturing system including the same, and method of manufacturing a semiconductor device using the same

An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.

Inspection device for inspecting wafer and method of inspecting wafer using the same

Disclosed are an inspection apparatus and a method of manufacturing a semiconductor device using the same. The inspection apparatus includes a stage configured to receive a substrate, an objective lens on the stage and configured to enlarge the substrate optically, an ocular lens on the objective lens and configured to form at its image plane an image of the substrate, and a plurality of sensors above the ocular lens and in the image plane of the ocular lens.

Inspection apparatus and method of manufacturing semiconductor device using the same

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Yongin-si, South Korea

Sangbong Park