Samsung Electronics Co., Ltd.

Sangbok Yun

Hyongsik Won

Yeonjun Sung

Soonwon Jeong

Joonwoo Jeon

Hanna Heo

Jongho Lim

Hosik Jun

Seungjin Yoon

A light emitting device package includes a package substrate, a semiconductor light emitting device on the package substrate, the semiconductor light emitting device including a substrate with a light emitting structure, a wavelength conversion portion on the semiconductor light emitting device, the wavelength conversion portion including a first region overlapping the light emitting structure, and a second region other than the first region, an adhesive layer between the semiconductor light emitting device and the wavelength conversion portion, and a reflective resin portion on the package substrate, the reflective resin portion surrounding the semiconductor light emitting device and the wavelength conversion portion, and the reflective resin portion extending to the second region.

Light emitting device package

A light emitting device package includes a first molding member surrounding a heat dissipation frame, a first electrode frame, and a second electrode frame; a first semiconductor light emitting device on the heat dissipation frame and having first and second pads; a second semiconductor light emitting device on the heat dissipation frame and having first and second pads; a wavelength conversion layer on the first and second semiconductor light emitting structures; a first bonding wire connected to the first pad of the first semiconductor light emitting device and the first electrode frame; a second bonding wire connected to the second pad of the second semiconductor light emitting device and the second electrode frame; and an inter-chip bonding wire connecting the second pad of the first semiconductor light emitting device to the first pad of the second semiconductor light emitting device.

A light emitting diode (LED) package is provided. The LED package includes a package body having a concave portion; an LED chip disposed on the concave portion; a phosphor sheet disposed on the LED chip; a barrier wall disposed on the concave portion and spaced apart from the LED chip by a first distance, the barrier wall being disposed in parallel with at least one side surface of the LED chip, an upper surface of the barrier wall being higher than an upper surface of the LED chip with respect to the lower surface of the concave portion and disposed at a level that is 50 &#x3bc;m or less from an upper surface of the phosphor sheet; and an encapsulation portion disposed on the LED chip, a side surface of the phosphor sheet and a side surface of the barrier wall.

Light emitting diode package

Growing community of inventors

Suwon-si, South Korea

Sangbok Yun