Samsung Electronics Co., Ltd.

Sangbo Lee

Jin Ho Kim

Chulwoo Park

Chankyung Kim

Sua Kim

Taek-Sung Kim

Seonghyun Jeon

Hongsun Hwang

SoonYong Hur

A semiconductor package includes first and second slave chips stacked vertically; and a master chip connected to the first and second slave chips, each of the slave chips including, a plurality of memory blocks, and a redundancy block, and the master chip including, a fuse block configured to repair a defective memory block detected from the first slave chip and a defective memory block detected from the second slave chip by using the redundancy block of the first slave chip and the redundancy block of the second slave chip, respectively, and a block selection circuit configured to, connect the redundancy blocks of the first and second slave chips, one or more non-defective ones of the plurality of memory blocks of the first slave chip, and one or more non-defective ones of the plurality of memory blocks of the second slave chip to an input/output circuit.

Semiconductor package including stacked chips and method of fabricating the same

A nonvolatile memory includes multiple banks, control logic and multiple read and write (RW) circuits. Each bank includes multiple memory cells. The control logic includes multiple storage units corresponding to the banks, respectively, and configured to output write enable signals and read enable signals to respective banks based on mode information stored in respective storage units. The RW circuits are connected to the banks, respectively, and are configured to independently enable or disable write and read operations of the respective banks in response to the write enable signals and the read enable signals of the respective banks. In an initial state after the mode information is stored in the respective storage units, the control logic activates the write enable signals and the read enable signals of the respective banks regardless of the mode information stored in the respective storage units.

Nonvolatile memory and method of operating nonvolatile memory

A semiconductor memory device may include a common source region on a substrate, an active pattern between the substrate and the common source region, a gate pattern facing a sidewall of the active pattern, a gate dielectric pattern between the gate pattern and the active pattern, a variable resistance pattern between the common source region and the active pattern, and an interconnection line.

Semiconductor memory devices including vertical transistor structures

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Yongin-si, South Korea

Sangbo Lee