Lg Innotek Co., Ltd.

Samsung Electronics Co., Ltd.

Sang Yeon Han

Young Taek Oh

Young Don O

Sang Ho Lee

Eun Ah Kim

Ki Seok Lee

Yoo Sang Hwang

Jay-Bok Choi

Jin-Hwan Chun

Keun Nam Kim

Sung Hee Han

Seung Uk Han

Yong Seok Ahn

Tae Hoon Kim

Jung Hwan Kim

Jun Young Choi

Yong Nam Choi

Sung-Jin Yeo

Woo Yeong Lee

Deok Yong Lee

Jong In Kang

Yoon Gi Hong

A camera module according to an embodiment includes a circuit board including a cavity; a first plate including a first region vertically overlapping the cavity and a second region other than the first region; a second plate disposed on the first region of the first plate; and an image sensor disposed on the second plate; and wherein an upper surface of the second plate is positioned lower than an upper surface of the circuit board.

Camera module

The present embodiment relates to a camera device comprising: a bracket comprising a first hole and a second hole; a first camera module disposed in the first hole of the bracket; a second camera module disposed in the second hole of the bracket; a first magnet disposed on the outer surface of the first camera module; and a second magnet disposed at a position corresponding to the first magnet on the outer surface of the bracket, wherein the first magnet is fixed to the outer surface of the first camera module and the second magnet is movably disposed on the bracket.

Camera device

The present embodiment relates to a camera module comprising: a bobbin, which has a through-hole formed therein; a lens module, which is accommodated in the through-hole and is coupled to the bobbin; a protrusion formed to protrude from the outer peripheral surface of the lens module; and a recess formed to be recessed from the inner peripheral surface of the bobbin so as to accommodate at least a part of the protrusion, wherein the recess comprises a first guide portion, which extends downwards from the upper end of the bobbin, and a second guide portion, which extends so as to slope from the first guide portion.

Camera module and optical device

A semiconductor device is provided. The semiconductor device includes a substrate which includes a cell region and a core region, a boundary element separation film which is placed inside the substrate, and separates the cell region and the core region, and a bit line which is placed on the cell region and the boundary element separation film and extends along a first direction, in which the boundary element separation film includes a first region and a second region, a height of an upper side of the first region of the boundary element separation film is different from a height of an upper side of the second region of the boundary element separation film, on a basis of a bottom side of the boundary element separation film, and the bit line is placed over the first region and the second region of the boundary element separation film.

Semiconductor device

One embodiment of a camera module comprises: a lens barrel including at least one lens; a bobbin for accommodating the lens barrel; and a fixing part disposed between the lens barrel and the bobbin so as to inhibit the lens barrel from being separated from the bobbin, wherein one surface, which makes surface contact with the fixing part, of the bobbin can include a bobbin provided so as to protrude toward the lens barrel.

Lens driving device and camera module including same

The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.

Dual camera module and optical device

A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.

Semiconductor device and method of fabricating the same

Provided is a camera module. A camera module according to one aspect of the present invention comprises: a first bracket including a first hole; a second bracket which includes a first groove and which is connected to the first bracket; a first lens module arranged in the first hole of the first bracket; and a second lens module arranged in the first groove of the second bracket, wherein the second lens module is formed to be smaller than the first groove, and the second bracket has a first protrusion being extended inwardly from the inner side surface of the first groove so as to fix the position of the second lens module.

Growing community of inventors

Seoul, South Korea

Sang Yeon Han