Samsung Electronics Co., Ltd.

Jntg Co., Ltd.

Sang Wook Jang

Tae Hyun Kim

Eun Sook Lee

Jy Young Jyoung

Eun Chong Kim

Tae Nyun Kim

Matsumoto Satoru

Min Jee Yang

Tae Hyong Kim

Provided is a carbon substrate for a gas diffusion layer of a fuel cell. The carbon substrate has a structure, in which a plurality of unit carbon substrates are stacked. Each of the unit carbon substrates is a plate type substrate having a first surface and a second surface opposite to the first surface. Carbon fibers are randomly arranged on the first surface of the each unit carbon substrate. The number of the carbon fibers arranged in a machine direction of the unit carbon substrate is greater than the number of carbon fibers arranged in a transverse direction of the unit carbon substrate from the first surface to the second surface along a thickness direction of the unit carbon substrate; and, accordingly, an orientation gradient, in which the orientation in the machine direction increases from the first surface to the second surface, is shown.

Multi-layered carbon substrate for gas diffusion layer

Disclosed herein is a printed circuit board assembly of an electronic appliance including a plurality of boards on which electrical parts to perform functions necessary for the electronic appliance are separately arranged according to the specification of the electronic appliance. The printed circuit board assembly is divided into a plurality of boards, such that electrical parts having a common specification and electrical parts having different specifications are arranged on different boards, thereby optimizing the printed circuit board assembly and configuring the boards according to the specification of the electronic appliance without loss. Microprocessors are arranged on the boards, and the boards are connected to each other in a serial communication, thereby reducing the number of wiring harnesses (W/H) and thus configuring the printed circuit board assembly with high reliability. Furthermore, the boards are connected to each other in an insulation manner, thereby configuring the boards in an anti-resistance structure.

Printed circuit board assembly of electronic appliance

Growing community of inventors

Suwon-si, South Korea

Sang Wook Jang