University of Michigan

Shin Sung C&t Co., Ltd.

Epack, Inc.

Sang Woo Lee

Khalil Najafi

Sang-Hyun Lee

Kyu Dong Jung

Yong Kook Kim

Jay Mitchell

Onnop Srivannavit

Ci Moo Song

Keun Jung Youn

Muhammad Ali Shah

Provided is a MEMS acoustic sensor including a substrate and a cavity, a back plate supported on the substrate and including a plurality of through-holes, at least one anchor projecting from the back plate toward the substrate, and a diaphragm supported by the at least one anchor and deformed by a sound wave introducing from the outside through the cavity, wherein no part of the deformed diaphragm comes into contact with the substrate.

MEMS acoustic sensor

An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

Environment-resistant module, micropackage and methods of manufacturing same

Growing community of inventors

Ann Arbor, MI, United States of America

Sang Woo Lee