Samsung Electronics Co., Ltd.

Sang-won Shim

Sang-Won Park

Bongsoon Lim

Bong-Soon Lim

Kitae Park

Sang-Wan Nam

Yonghyuk Choi

Jin-Young Kim

Il-Han Park

Yoon-Hee Choi

Kang-Bin Lee

Hongsoo Jeon

Dongkyo Shim

Jae-Duk Yu

Tae-Hyun Kim

Taehyun Kim

Ki-Tae Park

Chiweon Yoon

Dong-Hun Kwak

Suk-Soo Pyo

Chankyung Kim

Pan-Suk Kwak

Yang-Lo Ahn

Wonbo Shim

Doosub Lee

Hojoon Kim

Seokmin Yoon

A three-dimensional semiconductor memory device may include a first stack structure block including first stack structures arranged in a first direction on a substrate, a second stack structure block including second stack structures arranged in the first direction on the substrate, a separation structure disposed on the substrate between the first and second stack structure blocks and including first mold layers and second mold layers, and a contact plug penetrating the separation structure. A bottom surface of the contact plug may contact the substrate.

Three-dimensional semiconductor memory device

Each of memory blocks of a nonvolatile memory device includes a memory cell region including first metal pads, first memory cells of a first portion of pillar, and second memory cells of a second portion of the pillar, and a peripheral circuit region including second metal pads, a row decoder, and a page buffer. When performing program operations based on consecutive addresses at a memory block selected from the memory blocks, the nonvolatile memory device sequentially completes first program operations of non-adjacent memory cells not adjacent to a boundary of the first portion and the second portion from among the first and second memory cells and then completes a second program operation of an adjacent memory cell adjacent to the boundary. The peripheral circuit region is vertically connected to the memory cell region by the first metal pads and the second metal pads directly.

Nonvolatile memory device, storage device, and operating method of nonvolatile memory device

A nonvolatile memory device comprises a first semiconductor layer including, an upper substrate, and a memory cell array in which a plurality of word lines on the upper substrate extend in a first direction and a plurality of bit lines extend in a second direction. The nonvolatile memory device comprises a second semiconductor layer under the first semiconductor layer in a third direction perpendicular to the first and second directions, the second semiconductor layer including, a lower substrate, and a substrate control circuit on the lower substrate and configured to output a bias voltage to the upper substrate. The second semiconductor layer is divided into first through fourth regions, each of the first through fourth regions having an identical area, and the substrate control circuit overlaps at least a portion of the first through fourth regions in the third direction.

Vertical memory device including substrate control circuit and memory system including the same

A three-dimensional semiconductor memory device may include a peripheral circuit structure including transistors on a first substrate, and a cell array structure on the peripheral circuit structure, the cell array structure including: a first stack structure block comprising first stack structures arranged side by side in a first direction on a second substrate, a second stack structure block comprising second stack structures arranged side by side in the first direction on the second substrate, a separation structure disposed on the second substrate between the first stack structure block and the second stack structure block and comprising first mold layers and second mold layers, and a contact plug penetrating the separation structure. The cell array structure may include a first metal pad and the peripheral circuit structure may include a second metal pad. The first metal pad may be in contact with the second metal pad.

A nonvolatile memory device including: a first semiconductor layer including word lines, bit lines, first and second upper substrates adjacent to each other and a memory cell array, wherein the memory cell array includes a first vertical structure on the first upper substrate and a second vertical structure on the second upper substrate; and a second semiconductor layer under the first semiconductor layer, wherein the second semiconductor layer includes a lower substrate that includes row decoder and page buffer circuits, wherein the first vertical structure includes a first via area in which a first through-hole via is provided, wherein the first through-hole via passes through the first vertical structure and connects a first bit line and a first page buffer circuit, and the second vertical structure includes a first partial block, wherein the first partial block overlaps the first via area.

Nonvolatile memory device having a vertical structure and a memory system including the same

A nonvolatile memory device including: a first semiconductor layer comprising a plurality of first word lines extending in a first direction, a first upper substrate and a first memory cell array, a second semiconductor layer including a plurality of second word lines extending in the first direction, second and third upper substrates adjacent to each other in the first direction and a second memory cell array, wherein the second memory cell array includes a first vertical structure on the first upper substrate and a second vertical structure on the second upper substrate, wherein the first semiconductor layer and the second semiconductor layer share a plurality of bit lines extending in a second direction, and a third semiconductor layer under the second semiconductor layer in a third direction perpendicular to the first and second directions, wherein the third semiconductor layer includes a lower substrate that includes a plurality of row decoder circuits and a plurality of page buffer circuits, wherein the first vertical structure includes a first via area in which a first through-hole via is provided, wherein the first through-hole via passes through the first vertical structure and connects a first bit line and a first page buffer circuit, and the second vertical structure includes a first partial block, wherein the first partial block overlaps the first via area in the first direction.

An operating method of a storage device which includes a first nonvolatile memory device and a second nonvolatile memory device includes detecting sudden power-off, suspending an operation being performed in the first nonvolatile memory device, in response to the detected sudden power-off, writing suspension information about the suspended operation into the second nonvolatile memory device, and performing a block management operation on the first nonvolatile memory device based on the suspension information written into the second nonvolatile memory device, in power-up after the sudden power-off.

Storage device and operating method thereof

Each of memory blocks of a nonvolatile memory device includes first memory cells of a first portion of pillar and second memory cells of a second portion of the pillar. When performing program operations based on consecutive addresses at a memory block selected from the memory blocks, the nonvolatile memory device sequentially completes first program operations of non-adjacent memory cells not adjacent to a boundary of the first portion and the second portion from among the first and second memory cells and then completes a second program operation of an adjacent memory cell adjacent to the boundary.

A semiconductor memory device includes a substrate, first memory cells that are connected to first word lines extending along a first direction and first bit lines extending along a second direction, over the substrate, first conductive materials that are connected to the first word lines and extend from the first word lines along a third direction perpendicular to the first direction and the second direction, second conductive materials that are connected to the first bit lines and extend along the first direction over the first bit lines, and third conductive materials that are connected to the second conductive materials and extend from the second conductive materials along the third direction.

Semiconductor memory device including parallel substrates in three dimensional structures

A nonvolatile memory device includes a voltage generator that sequentially provides a first setup voltage and second setup voltage to a word line of a memory cell array, and control logic including a time control unit that determines a word line setup time for the word line in relation to the second setup voltage based on a difference between the first and second setup voltages.

Nonvolatile memory device and method of operation with a word line setup time based on two sequential read voltages

A nonvolatile memory device for reducing hot-carrier injection (HCI) and a programming method of the nonvolatile memory device, the programming method of the nonvolatile memory device includes programming memory cells included in a cell string in a direction from an upper memory cell adjacent to a string selection transistor to a lower memory cell adjacent to a ground selection transistor from among a plurality of memory cells; when a selected memory cell is programmed, applying a first inhibition voltage to first non-selected word lines connected to first non-selected memory cells located over the selected memory cell; and applying a second inhibition voltage to second non-selected word lines connected to second non-selected memory cells located under the selected memory cell when a predetermined delay time elapses after the first inhibition voltage is applied.

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Seoul, South Korea

Sang-won Shim