Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Sdi Co., Inc.

Samsung Display Devices Co., Ltd.

Korea University Research and Business Foundation

Korea Institute of Industrial Technology

Sungkyunkwan University

Korea Institute of Science and Technology

Korea University Industry and Academy Cooperation Foundation

Dotter Co., Ltd.

Sang-Won Lee

Jong-seo Choi

Geun-Bae Kim

Kyu-nam Joo

Kwi-Seuk Choi

Jin Wook Seo

Min-Sik Um

Jin-Sung Choi

Seong-Yong Hwang

Joong-Hyun Kim

Chang-Soo Kim

Ju-Hwa Ha

Byung-se So

Min-young Song

Hyoung-Rae Lee

Myun-joo Park

Duk-Hwan Kang

Seung-Hwan Baek

Wan-Seog Oh

Myung-Ho Won

Kwang-min Lee

O-hung Kwon

Gyu-Su Lee

Kwan-Young Joung

Hangyeore Lee

Jonghyeok Park

Hwang-chul Bae

Yong-Kyu Kang

Seok-Won Hyung

Seok Pil Lee

Ho-Jin Kweon

Jin-Young Kim

Jong-Chul Choi

Jun-Won Suh

Tae Hwan Kim

Eui-Hwan Song

Jin-Hong Kim

Hyung-Jin Kim

Young-keun Lee

Yong-Ho Lee

Soohyun Bae

Seok-Hyun Nam

Hyunki Kim

Hyunjung Park

Jae-Jun Lee

Hyun Sik Hwang

Young Ik Eom

Jung-Joon Park

Jin Young Kim

Min Young Park

Donghwan Kim

Jae-Sang Lee

Bongim Park

Hyung-gon Noh

Chan-Jae Park

Czang-Ho Lee

Hyunggil Baek

Tae-Seok Ha

Hyo-Sun Kim

Min-Sik Kim

Dong-sung Im

Byeong-yun Nam

Yong Kwan Lee

Geun-bae Kim

Yoonmook Kang

Hae-Seok Lee

Tae-Ho Lee

Jikhan Jung

Young-Ja Kim

Seok-Kun Yoon

Ikhyun Ahn

JiYoung Eom

Dongkun Shin

Wonkyu Lee

Kwang-Sik Kim

Seonghwan Choi

Young-ja Kim

Kyu-Nam Joo

Sogi Choi

Ki-pyo Ahn

Hyung Gil Baek

Seong-Il Kim

Dae-hee Won

Geun-kyu Song

Kyoung-Jin Seo

Chul Shin

Young-Bae Roh

Eung-Kil Choi

Kwi-seuk Choi

Jun-Ki Hong

Youn-Ho Han

Dae-Hee Won

Dong-Wook Lee

Sungmu Kim

Hyun-Jong Kim

Byoung-Gook Jeong

O-Hung Kwon

Kui-Wn Kim

Hyo-Jin Sim

Il-Ki Woo

A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specification thereof, and performing the solder ball attaching process based on the method of the solder ball attaching process. The determining of the specification of the ball tool and the method of the solder ball attaching process includes determining a number of a plurality of holders in the ball tool and a position and a width of each of the plurality of holders, determining a number of a plurality of working regions of a substrate and a position and a width of each of the plurality of working regions, and dividing a substrate into the plurality of working regions.

Method of manufacturing semiconductor package

Provided is a file system including a sequential-writing unit configured to perform sequential write to a new block position of a segment when updating a data block, an updating unit configured to update a page mapping table by mapping a logical page number newly allocated to the new block position and a physical page number newly allocated corresponding thereto, and a remapping unit configured to modify the page mapping table by applying a remap command.

Method and system for updating file in file system using a remap command

A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.

Semiconductor package aligning interposer and substrate

Disclosed are non-contiguous sample fractionating and concatenating device and a dual online multidimensional liquid chromatography system having the same. The non-contiguous sample fractionating and concatenating device according to an embodiment of the present disclosure includes a sample supply module which supplies a sample to be analyzed, and a sample fractionation module connected to the sample supply module, and which is continuously supplied with the sample, sets a plurality of unit sample supply times obtained by equally dividing a total sample supply time during which the sample is supplied from the sample supply module, sets a plurality of unit fractionation intervals obtained by equally dividing each of the plurality of unit sample supply times, and concatenates and stores the sample supplied during corresponding unit fractionation intervals within each unit sample supply time to acquire a plurality of fractions.

Non-contiguous sample fractionating and concatenating device and dual online multidimensional liquid chromatography system having the same

Disclosed is an image segmentation device. The image segmentation device may include: a storage unit storing a segmentation model learned so as to segment at least one predetermined object; and at least one processor inputting input data into the segmentation model and segmenting at least one predetermined object in the input data, in which the segmentation model may include an encoder including at least one dimension reduction block reducing a dimension of the input data, a decoder including at least one dimension increase block increasing the dimension of output data output from the encoder by using data output from at least one dimension reduction block, and an auxiliary classification model receiving the output data and recognizing whether a specific object is included in the output data.

Deep learning based image segmentation method including biodegradable stent in intravascular optical tomography image

Disclosed are a solar cell including an upper cell includes an upper passivation layer disposed on an upper surface of a functional layer, a transparent electrode disposed on an upper surface of the upper passivation layer, an upper first charge transport layer disposed on an upper surface of the transparent electrode, an upper electrode disposed on the upper first of the transparent electrode to be adjacent to the upper surface charge transport layer, an upper second charge transport layer disposed on the upper surface of the functional layer to be spaced apart from the upper passivation layer, the transparent electrode, the upper first charge transport layer, and the upper electrode, and an upper absorption layer disposed on the upper passivation layer, the transparent electrode, the upper first charge transport layer, and the upper second charge transport layer.

Solar cell and solar cell module including the same

A method of driving a display device includes: sensing characteristic information of pixels by outputting sensing voltages to sensing lines; and operating an external compensation of the pixels based on the characteristic information. The sensing of the characteristic information of pixels includes: detecting a capacitance deviation of sensing capacitors of first sensing lines connected to the sensing lines; and sensing the characteristic information of the pixels by replacing at least one of the first sensing lines with a second sensing line based on the capacitance deviation.

Display device and method of driving display device to sense a characteristic value of a driving transistor included in a pixel

A semiconductor package includes a first sub-semiconductor package, an interposer substrate, and a second sub-semiconductor package that are sequentially stacked. The first sub-semiconductor package includes a first package substrate, a first semiconductor device, and a first mold member that are sequentially stacked, and the interposer substrate includes at least one hole. The first mold member includes: a mold main portion which covers the first semiconductor device; a mold connecting portion extended from the mold main portion and inserted into the at least one hole; and a mold protruding portion extended from the mold connecting portion to cover a top surface of the interposer substrate outside the at least one hole. The mold main portion, the mold connecting portion, and the mold protruding portion constitute a single object.

Semiconductor package including a substrate, a semiconductor device, and a mold

Disclosed is a storage device, which include a non-volatile memory device including a plurality of memory blocks, a buffer memory, and a storage controller that receives a first allocation request and first logical address information from a host, allocates logical addresses of the first logical address information to a first physical group of the plurality of memory blocks in response to the first allocation request, receives a first write request and first write data associated with the first logical address information, stores the first write data in the buffer memory, and writes the first write data stored in the buffer memory in memory blocks of the first physical group in response to the first write request. The first allocation request precedes the first write request.

Storage device, for allocating physical space for logical address before receiving write request, operating method thereof, and storage system including the same

A display device includes a display panel including a first pixel and a second pixel, a reference gamma generator configured to generate a first reference gamma voltage and a second reference gamma voltage based on a driving mode, a stain compensator configured to output a stain compensating data that compensates a stain of an image data based on the driving mode, and a data driver configured to generate a first data voltage provided to the first pixel based on the first reference gamma voltage and the stain compensating data and a second data voltage provided to the second pixel based on the second reference gamma voltage and the stain compensating data.

Display device

This invention relates to a nucleic acid aptamer specifically binding to avian influenza virus subtype H5 and a method of detecting avian influenza virus subtype H5 using the same, and more particularly to a method of detecting avian influenza virus subtype H5, which is able to rapidly check the presence and concentration of avian influenza virus subtype H5 using a nucleic acid aptamer specifically binding to hemagglutinin, which is a surface protein of avian influenza virus subtype H5.

Nucleic acid aptamer specifically binding to avian influenza virus subtype H5 and method of detecting avian ifluenza virus subtype H5 using the same

A dual online liquid chromatography device according to an embodiment of the present invention comprises: a first pump for injecting a first solvent or a mixed solution containing the first solvent and a second solvent; a second pump for injecting the first solvent or the mixed solution containing the first and second solvents; a specimen intake valve connected to the first pump and a specimen injector for injecting a specimen; a column selection valve connected to the second pump and the specimen intake valve; and a dual column valve including a plurality of ports, one side of which is connected to the column selection valve and an opposite side of which is connected to a first column and a second column.

Dual online liquid chromatography device and control method thereof

Technical objective is to provide an in-pipe inspection robot for inspecting interior of a pipe, which can exert repulsive force to the pipe when the linear actuator is driven. To this purpose, the in-pipe inspection robot, which is moved inside the pipe to inspect the interior of the pipe, includes a linear actuator which is extendably and contractably driven, and a braking unit configured to fix a rear end of the linear actuator to an inner wall of the pipe and release a front end of the linear actuator from a fixed state, when the linear actuator is being extended, and release the rear end of the linear actuator from the fixed state and fix the front end of the linear actuator to the inner wall of the pipe, when the linear actuator is being contracted.

In-pipe inspection robot

A light guide plate for a backlight. The light guide plate includes: a light source unit for generating light; a light guide plate proximate to the light source unit and including an upper surface and a lower surface; and a light emission pattern configured to diffuse a portion of the light directed toward an image display panel, and a first straight pattern configured to channel the light along a direction substantially parallel to a direction of propagation of the light generated by the light source unit, both the light emission pattern and the first straight pattern being disposed on one of the upper surface and the lower surface of the light guide plate, in which the first straight pattern has peaks and valleys formed in alternating and repeating manner in a direction substantially perpendicular to a direction of propagation of the light generated by the light source unit.

Light guide plate for backlight and manufacturing method therefor

An electronic device is provided. The electronic device includes a body configured to house the electronic device and including a space for accommodating a battery on one surface of the body and a cover configured to cover at least the space and being detachably attached to the body. The cover includes a first sealing member located between the one surface of the body and an inner surface of the cover and formed to surround the space.

Electronic device and protective cover therefor

Growing community of inventors

Yongin-si, South Korea

Sang-Won Lee