Samsung Electronics Co., Ltd.

Sang-uk Han

Jeong-Kyu Ha

Jae-Min Jung

Kyong-Soon Cho

KwanJai Lee

Young-shin Kwon

Kwan-jai Lee

A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.

Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal

A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern.

Tape wiring substrate and chip-on-film package including the same

Growing community of inventors

Gyeonggi-do, South Korea

Sang-uk Han