Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Other

Hyundai Motor Company

Kia Motors Corporation

Sumitomo Electro-mechanics Co., Ltd.

Aiwin Co., Ltd.

Sang Soo Park

Min Cheol Park

Byoung Hwa Lee

Young Ghyu Ahn

Woo Chul Shin

Dong Seok Park

Heung Kil Park

Sung Kwon Wi

Hwi Dae Kim

Hae Suk Chung

Chan Young Yoon

Ji Hong Jo

Ho Yoon Kim

Dong Hwan Lee

Beom Joon Cho

Ki Jun Kim

Soon Ju Lee

Dong Jin Lee

Kyo Kwang Lee

Tae Hyeok Kim

Dong Hwi Shin

Chang Hoon Shim

Hye Mi Yoo

Gu Won Ji

Doo Young Kim

Ho Young Kim

Soo Hwan Son

Jin Kyung Joo

Min Gon Lee

Jin Man Jung

Seung Woo Song

Jeong Ho Yoon

Kyoung Jin Jun

Nam Chul Kim

Hong Yeon Cho

Yong Suk Kim

Doo Il Kim

Young Seuck Yoo

Won Chul Sim

Hee Soo Yoon

Ki Won Kim

Jae Cheol Ju

Don Chul Choi

Kang Heon Hur

Je Jung Kim

Hyun Tae Kim

Seok Kyoon Woo

Do Young Jeong

Seung Heon Han

Hyun Ju Yi

Hyun Cheol Oh

Woo Jin Shin

Chae Min Park

Ji Hee Moon

Woo Chui Shin

Seayoung Ahn

Se Hwa Jeong

Min Kyoung Kwon

Young Jun Cha

Jong Ho Lee

Jae Yeol Choi

Sung Jin Park

Do Yeon Kim

Jung Min Park

Young Key Kim

Jae Hyuk Choi

Hong Kyu Shin

Yongkyu Lee

Jae Young Na

Man Su Byun

Dongkyo Shim

So Yeon Song

Sung-Min Joe

Sung Pil Choi

Jea Yeol Choi

Seung Hyun Ra

Soo-Woong Lee

Choon Ki Lee

Hyeog Soo Shin

Bong Sup Lim

Chung-Ho Yu

Sang Roc Lee

Hwi Geun Im

Kyung Nam Hwang

Ill Kyoo Park

Cheol Sang Kim

Joon Yeob Cho

Oh Choon Kwon

Doo-Ho Cho

Jin Soon Kim

Kyong Nam Hwang

Duc Soo Moon

Choon Sung Lee

Bum Chul Bae

Su Jung Kim

Sang Il Jung

Jin Yong Lim

Young Sun Park

Hiroki Sato

James Mike Peters

A memory device includes a substrate, a first cell string, second cell string, and third cell string, each connected to a first bit line and formed in a direction perpendicular to a top surface of the substrate, a first upper ground selection line connected to the first cell string, a second upper ground selection line separated from the first upper ground selection line and connected to the second and third cell strings, a first lower ground selection line connected to the first and second cell strings, and a second lower ground selection line separated from the first lower ground selection line and connected to the third cell string.

Memory device including asymmetric ground selection lines

A coil component includes a body; a coil disposed in the body; first and second external electrodes disposed on a first surface of the body, which is a lower surface of the body, spaced apart from each other, and connected to the coil; and first and second terminals disposed on lower surfaces of the first and second external electrodes, respectively, to be in contact with the first and second external electrodes.

Coil component

The present disclosure relates to an impeller driving device for a cooling pump of an electric outboard device, configured so that a gearbox housing is installed on an outboard-device body and an impeller housing is installed against an outer surface of a right side of the gearbox housing on the outboard-device body to drive the impeller for the cooling pump of the electric outboard device.

Impeller driving device for cooling pump of electric outboard device

Disclosed is a nonvolatile memory device which includes a first plane that includes a plurality of memory blocks, a second plane that includes a plurality of memory blocks, an address replacing circuit that receives a first input address from an external controller, the first input address corresponding to a first memory block of the plurality of memory blocks of the first plane from an external controller and outputs a replaced address based on the first input address and bad block information, and an address decoder that controls word lines connected with a second memory block based on the replaced address, the word lines corresponding to the replaced address from among the plurality of memory blocks of the second plane. The first memory block of the first plane is a bad block.

Nonvolatile memory device and operation method thereof

A coil component includes a body, a planar spiral-shaped coil portion disposed in the body, a lead portion disposed to be spaced apart from the coil portion in the body, a support substrate disposed between the coil portion and the lead portion to correspond to the lead portion, a via penetrating through the support substrate to connect an internal end portion of the coil portion and an internal end portion of the lead portion to each other, an insulating layer covering the coil portion and the lead portion, and a first external electrode and a second external electrode disposed to be spaced apart from each other on a surface of the body and connected to the external end portion of each of the coil portion and the lead portion.

A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and the upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5≤B/A.

Multilayer capacitor and substrate including the same mounted thereon

A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016≤A/B<1 in which A is a thickness of the dielectric layer and B is an average length of margins of the capacitor body in a length direction, and A is 1 μm or less.

Multilayer capacitor and board having the same mounted thereon

A coil component includes a body, a coil portion disposed in the body, and first and second external electrodes disposed on the body to be spaced apart from each other, wherein A/C≥2.4 and B/C≥1.6 are satisfied, where a length, a width, and a thickness of the coil component are defined as 'A', ‘B’, and ‘C’, respectively, and a ratio of a thickness to a width of at least one turn of the coil portion is 1 or less, based on a cross-section of the coil component.

A coil component includes a core portion, and first and second coil portions wound to form at least one or more turns on the core portion. The core portion includes a first core portion on which the first coil portion is wound, a second core portion on which the second coil portion is wound, and a third core portion which is disposed to be spaced apart from and between the first and second core portions and on which the first and second coil portions are wound to overlap each other.

A coil component includes a body, a coil portion disposed in the body and having first and second lead-out portions exposed to at least one surface of the body to be spaced apart from each other, first and second external electrodes disposed on the at least one surface of the body to be spaced apart from each other, and respectively connected to the first and second lead-out portions, a dielectric layer disposed on a surface of the body, and a third external electrode disposed on the surface of the body having the dielectric layer disposed thereon to be spaced apart from each of the first and second external electrodes, and covering the dielectric layer.

A coil component includes a body having a core, a coil portion disposed in the body and having a central portion in which the core is disposed, a first external electrode and a second external electrode, each connected to the coil portion, a third external electrode spaced apart from each of the first and second external electrodes, and a noise removal portion disposed to at least partially surround the coil portion between a surface of the body and the core and having both end portions, each connected to the third external electrode.

A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.

Multilayer ceramic capacitor

An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.

Electronic component

A coil component includes a body; first and second coil portions spaced apart from each other in the body; first and second external electrodes disposed on the body to be spaced apart from each other and connected to both ends of the first coil portion; and first and second ground electrodes spaced apart from each other on the body and connected to both ends of the second coil portion.

Coil component and board having the same mounted thereon

A coil component includes a winding-type coil including a coil portion and first and second lead-out portions respectively connected to the coil portion; a body in which the winding-type coil is disposed, the first and second lead-out portions of the winding-type coil exposed from the body; a noise removal portion including a pattern portion spaced apart from a metal wire of the winding-type coil in the body and having both end portions spaced apart from each other to have an open-loop, and a third lead-out portion connected to the pattern portion and exposed from the body; an insulating layer disposed between the winding-type coil and the noise removal portion; and first to third external electrodes arranged on the body to be spaced apart from each other and respectively connected to the first to third lead-out portions.

Growing community of inventors

Suwon-si, South Korea

Sang Soo Park