Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Yonsei University

Sang-Soo Jee

Eun-Sung Lee

Se-Yun Kim

Sang-mock Lee

Do-hyang Kim

In-Taek Han

Dong-earn Kim

Sang-Eui Lee

Ha-Jin Kim

Yoo-Seong Yang

Jun Ho Lee

Se Yun Kim

Seung Yeon Lee

Jin-man Park

Soon-Jae Kwon

Jung Yun Won

Ka Ram Lim

Jin-Young Bae

Ka-Ram Lim

Suk-Jun Kim

Disclosed is a conductive paste including; a conductive powder including a plurality of conductive particles, a metallic glass disposed between adjacent conductive particles of the conductive powder, and an organic vehicle in which the conductive powder and metallic glass are disposed, and a solar cell using the conductive paste.

Conductive paste and solar cell

According to example embodiments, a conductive paste includes a conductive component that contains a conductive powder and a titanium (Ti)-based metallic glass. The titanium-based metallic glass has a supercooled liquid region of about 5K or more, a resistivity after crystallization that is less than a resistivity before crystallization by about 50% or more, and a weight increase by about 0.5 mg/cmor less after being heated in a process furnace at a firing temperature. According to example embodiments, an electronic device and a solar cell may include at least one electrode formed using the conductive paste according to example embodiments.

Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste

A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass has a resistivity that is decreased when the metallic glass is heat treated at a temperature that is higher than a glass transition temperature of the metallic glass.

According to an example embodiment, a conductive paste includes a conductive powder, a metallic glass having a supercooled liquid region, and an organic vehicle. The metallic glass may include an alloy having a disordered atomic structure that includes at least two metals. An electronic device and/or solar cell may include an electrode formed using the conductive paste. An electrode formed using a conductive paste according to example embodiments may have lower contact resistance than an electrode formed using a conductive paste that includes glass frits instead of a metallic glass.

A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass includes an alloy of at least two elements selected from an element having a low resistivity, an element which forms a solid solution with the conductive powder, or an element having a high oxidation potential, wherein the element having a low resistivity has a resistivity of less than about 100 microohm-centimeters, and the element having a high oxidation potential has an absolute value of a Gibbs free energy of oxide formation of about 100 kiloJoules per mole or greater.

A conductive paste including a combination of: a conductive powder, a metallic glass, and a dispersing agent represented by the following Chemical Formula 1R-L-(OR)&#x2014;(OR)&#x2014;O-L-COOH.&#x2003;&#x2003;Chemical Formula 1In Chemical Formula 1, Ris a substituted or unsubstituted C5 to C30 branched alkyl group, Rand Rare each independently a substituted or unsubstituted C2 to C5 alkylene group, Lis a substituted or unsubstituted C6 to C30 arylene group, Lis a single bond or a C1 to C4 alkylene group, n and m are each independently integers ranging from 0 to about 30, and 3&#x2266;n+m&#x2266;30.

Conductive paste, and electronic device and solar cell including an electrode formed using the conductive paste

A carbon/epoxy composition includes a bisphenol-based epoxy, an amine-based curing agent, an imidazole-based curing catalyst, and carbon black. A carbon-epoxy dielectric layer is fabricated using a reaction product of the carbon/epoxy composition.

Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same

A heating member includes a resistive heating layer disposed on an outermost layer of the heating member, where the resistive heating layer includes a conductive filler distributed in a base material and where the resistive heating layer emits heat when supplied with an electric current from an electrode, and a contacting unit which exposes the conductive filler of the resistive heating layer and contacts the electrode.

Heating member including resistive heating layer, and fusing apparatus and image forming apparatus including the heating member

A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.

Fusing device including resistive heating layer and image forming apparatus including the fusing device

A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.

Growing community of inventors

Hwaseong-si, South Korea

Sang-Soo Jee