Samsung Electronics Co., Ltd.

Sang-Shin Jang

Jong-Min Baek

Woo-Kyung You

Byung-Hee Kim

Kyu-Hee Han

Viet Ha Nguyen

Sang-Hoon Ahn

Deok-Young Jung

Hyeok-Sang Oh

Vietha Nguyen

Hoon-Seok Seo

Sung-Jin Kang

Eui-Bok Lee

Provided herein is a method of forming micropatterns, including: forming an etching target film on a substrate; forming a photosensitivity assisting layer on the etching target film, the photosensitivity assisting layer being terminated with a hydrophilic group; forming an adhesive layer on the photosensitivity assisting layer, the adhesive layer forming a covalent bond with the hydrophilic group; forming a hydrophobic photoresist film on the adhesive layer; and patterning the photoresist film.

Methods of forming micropatterns and substrate processing apparatus

A semiconductor device includes a first insulating interlayer on a first region of a substrate and a second insulating interlayer on a second region of the substrate, a plurality of first wiring structures on the first insulating interlayer, the first wiring structures being spaced apart from each other, a plurality of second wiring structures filling a plurality of trenches on the second insulating interlayer, respectively, an insulation capping structure selectively on a surface of the first insulating interlayer between the first wiring structures and on a sidewall and an upper surface of each of the first wiring structures, the insulation capping structure including an insulating material, a third insulating interlayer on the first and second wiring structures, and an air gap among the first wiring structures under the third insulating interlayer.

Methods of manufacturing semiconductor devices

Semiconductor devices and methods of manufacturing the same

Growing community of inventors

Gwangyang-si, South Korea

Sang-Shin Jang