Samsung Electronics Co., Ltd.

Other

Autocrypt Co., Ltd.

Coupang, Corporation

Somansa Co., Ltd.

Sang Seok Lee

Ki Seok Kim

Je Won Kim

Duk Soo Kim

Sang Gyoo Sim

Eui Seok Kim

Jin Bock Lee

Hyun Kwon Hong

Seong Seok Yang

Joon Sub Lee

Joon Woo Jeon

Jong Guk Lee

Sang Min Lee

Seok Lee

Tae Wan Kim

Jin Ha Kim

Yong-Il Kim

Jung Hwan Choi

Ju Hyun Kim

Su Yeol Lee

Myong Soo Cho

Young Seok Oh

Jae Yeong Lee

Chan Mook Lim

Hwang Joon Lee

Gi Bum Kim

Il Hoon Choi

Ju-Bin Seo

Man Hee Kim

Yul Hee Lee

Jung Wook Kim

Yun Sung Lee

Sun Pyo Hong

Tae Nyun Kim

Kwang Min Song

Young Soo Lim

Ki Ho Chung

Ju Bin Seo

Ha Yeong Son

Bo Ra Moon

Jung Ook Kim

Nankyoung Kye

Yoo Cheol Na

Bong I Kim

Mun K Kim

Young K An

Nam C Kang

Jeong Ho Pi

Jae Ryung Yoo

Ki Ho Joo

Jung Won Lee

Hyun Kyung Park

Sook Jun Gweon

Hoon Jin Bang

A vehicle-to-everything (V2X) communication-based electronic toll collection system (ETCS) according to an embodiment of the present invention includes at least one roadside unit (RSU), a token issuer checking a de-identified token of a vehicle by communicating with an on-board unit (OBU) of the vehicle via the at least one roadside unit, and a clearing house communicating with the token issuer and charging a toll to a driver/owner of the vehicle. The token issuer generates toll information of the vehicle based on the de-identified token of the vehicle and location information of the at least one roadside unit involved in checking the de-identified token.

V2X-based electronic toll collection system and method

A device for secure and automated enrollment-certificate bootstrapping on keys and certificates for a vehicle to everything (V2X) environment of a V2X end entity in a security credential management system (SCMS) for V2X communication, the device comprising: a processor; and a memory configured to store at least one instruction to be performed by the processor, the at least one instruction is configured to instruct the processor to perform steps of: by a secure bootstrapping service (SBS) agent, checking, for an SSB server, configuration information; by the SBS agent, making a request for bootstrapping data to the SBS server; and by the SBS agent, installing the bootstrapping data in the SBS server.

Method of secure and automated bootstrapping on keys and certificates for V2X environment and device thereof

Provided is a delivery status management method performed by an electronic apparatus. The delivery status management method includes transmitting information associated with an item to a courier terminal, receiving information associated with a delivery progress status of the item from the courier terminal, and, when the information associated with the delivery progress status corresponds to a first type, performing a refund procedure for the item. According to the present disclosure, it is possible to provide a delivery status management method by which a refund caused by interruption of a delivery is not delayed and a refund procedure is performed quickly to a customer upon the interruption of the delivery.

Delivery status management method and electronic apparatus performing the same

A semiconductor light emitting device includes: a multilayer semiconductor body having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, an active layer between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, and at least one recess exposing the first conductivity-type semiconductor layer, and an insulating part on an internal sidewall of the at least one recess and an upper surface of the second conductivity-type semiconductor layer. The insulating part has an insulating spacer on the internal sidewall of the recess, and a lateral surface of the insulating spacer has a surface without an angular point from an upper end to a lower end thereof.

Semiconductor light emitting device

A semiconductor light emitting device includes a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; and an insulating layer on the light emitting structure and including first and second through-holes. The insulating layer includes a first lower insulating layer and a second lower insulating layer. The first insulating layer is disposed on the first conductivity-type semiconductor layer and is surrounded by the second lower insulating layer with the first through-hole interposed therebetween.

A one-time programmable (OTP) memory device includes an OTP memory cell array comprising a plurality of dummy cells and a plurality of main cell groups of main cells and an access circuit configured to write data to at least two of the cells simultaneously. The arrangement of the dummy cells and the main cell groups may allow for the reliable writing of multi-bit data to the memory array. Each of the main cell groups may include a plurality of main cells which are connected to word lines, respectively, and to bit lines, respectively. Each of the main cells may be writable and each of the dummy cells may be unwritable. Each of the main cells may include a contact layer, and the dummy cells might not include the contact layer. A supply voltage may be applied to the OTP memory cell array through the contact layer.

One-time programmable memory device having access circuit

A semiconductor light emitting device and method of manufacturing the semiconductor light emitting device are provided. The semiconductor light emitting device includes a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The device may also includes a first electrode connected to the first conductivity type semiconductor layer, and a second electrode connected to the second conductivity type semiconductor layer and having a pad region and a finger region extended from the pad region in one direction. The second electrode may include a transparent electrode part positioned on the second conductivity type semiconductor layer and including at least one opening therein, at least one reflective part spaced apart from the transparent electrode part within the opening and disposed in the pad region and the finger region, and a bonding part positioned on at least one portion of the reflective part and including a plurality of bonding finger parts spaced apart from each other in the finger region and a bonding pad part disposed in the pad region.

Semiconductor light emitting device and method of manufacturing the same

A method for manufacturing a spherical frozen food is provided. One or more plates are provided. The plates, when together, form a spherical mold. An inlet facilitates the injection of a mixture into the mold. The mold is subjected to a low temperature such that the mixture is caused to freeze. A rotating mechanism may cause one or more of the plates to open and/or rotate outwardly such that the frozen material may be removed from the mold with ease. Liquid nitrogen may be used to freeze the material.

Manufacturing equipment for rapidly freezing spherically-shaped foods using a cryogenic refrigerant

In example embodiments, a semiconductor light emitting device includes a light emitting structure, first and second insulating layers, a barrier metal layer, and an electrode. The light emitting structure includes an active layer between a first and second conductivity-type semiconductor layer. The first insulating layer is on the light emitting structure and defines a first one and a second one of first openings that respectively expose the first and second conductivity-type semiconductor layers. The barrier metal layer is on the first insulating layer and electrically connected to the first and second conductivity-type semiconductor layers through the first and second one of the first openings. The second insulating layer is on the barrier metal layer and defines a second opening that partially exposes the barrier metal layer. The electrode is on the barrier metal layer and electrically connected to the first and second conductivity-type semiconductor layers through the barrier metal layer.

Semiconductor light emitting device and semiconductor light emitting apparatus having the same

A semiconductor light emitting device is provided and includes a protective element including a first lower conductivity-type semiconductor layer and a second lower conductivity-type semiconductor layer. First and second lower electrodes are connected to the first lower conductivity-type semiconductor layer and the second lower conductivity-type semiconductor layer, respectively. A light emitting structure includes a first upper conductivity-type semiconductor layer, an active layer, and a second upper conductivity-type semiconductor layer sequentially formed on the protective element. First and second upper electrodes are connected to the first upper conductivity-type semiconductor layer and the second upper conductivity-type semiconductor layer, respectively.

Semiconductor light emitting device and method for manufacturing the same

Disclosed are a DLP security system and an operating method thereof. An operating method of a data loss prevention (DLP) apparatus, comprising: converting, into packets, Ethernet signals received from a fail over device that are transmitted and received between an external network and internal network; analyzing the packets to classify the packets into first packets required to be precisely judged and second packets not required to be precisely judged; distributing and allocating a judgment job about the first packet to at least one in-line instance according to a predetermined reference; and allocating the judgment job distributed to the in-line instance in which a fail occurs to the in-line instance which is normally operated when it is verified whether there is an in-line instance which is normally operated in the case where the fail occurs in the at least one in-line instance.

Apparatus and security system for data loss prevention, and operating method of data loss prevention apparatus

A semiconductor light emitting device includes a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer sequentially stacked on a substrate. A first electrode is disposed on a portion of the first conductivity-type semiconductor layer. A current diffusion layer is disposed on the second conductivity-type semiconductor layer and includes an opening exposing a portion of the second conductivity-type semiconductor layer. A second electrode covers a portion of the current diffusion layer and the exposed portion of the second conductivity-type semiconductor layer, wherein the portion of the current diffusion layer is near the opening.

A method of fingerprint verification includes determining a direction difference between a direction pattern of an input fingerprint and a direction pattern of a registered fingerprint and comparing the determined direction difference with predetermined upper and lower threshold values. The input and registered fingerprints are considered the same if the direction difference is lower than the lower threshold value, and the input and registered fingerprints are considered to be different if the direction difference is higher than the upper threshold value. If the direction different is between the upper and lower threshold values, minutiae of the input and registered fingerprints are extracted for verifying the input fingerprint. The extracting includes preprocessing of the input fingerprint image, uniboundary extraction of the input fingerprint minutiae, and restoration to eliminate pseudo-minutiae.

Method of fingerprint verification

Growing community of inventors

Seoul, South Korea

Sang Seok Lee