Samsung Electronics Co., Ltd.

Sang-Rok Oh

Kwang-Nam Kim

Jong-Woo Sun

Jung-Pyo Hong

Jeongryul Kim

Sung-Wook Jung

Hae-Joong Park

Byeong-Hee Kim

Nam-Young Cho

Hyung-Jun Kim

Yong-Moon Jang

Sang-Dong Kwon

Sung-Yeon Kim

A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Loadlock module and semiconductor manufacturing apparatus including the same

A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.

Substrate support apparatus and plasma processing apparatus having the same

Provided are substrate processing apparatuses including a temperature measurement unit. The substrate processing apparatus comprises a chamber including a substrate processing region, a dielectric sheet that is disposed on the substrate processing region and includes an insertion hole and a temperature measurement unit that is disposed on the dielectric sheet to measure the temperature of the dielectric sheet, and has a screw portion inserted into the insertion hole, wherein each of the insertion hole and the screw portion has thread helixes meshed with each other.

Substrate processing apparatus

Growing community of inventors

Yongin-si, South Korea

Sang-Rok Oh