Cheil Industries Inc.

Samsung Sdi Co., Inc.

Sang-Ran Koh

Woo-Han Kim

Sung-Hwan Cha

Sang-Kyun Kim

Jong-Seob Kim

Hui-Chan Yun

June-Ho Shin

Hyun-Jung Ahn

Eun-Seon Lee

Mi-Young Kim

Chang-Soo Woo

Hyeon-Mo Cho

Young-Ho Kim

Hong-Jung Yoo

Woo-Jin Lee

Chi-Won An

Ha-Neul Kim

Dong-Ju Shin

Ha Neul Kim

Chi Won An

Young-Eun Choi

Yong Kook Kim

Jin-Hee Bae

Taek-Soo Kwak

Il Yong Jung

Jun-Young Jang

Yoong-Hee Na

Bo-Sun Kim

Kun-Bae Noh

Byeong-Gyu Hwang

Doo-Young Jung

Wan-Hee Lim

Jun Sakong

Sae-Mi Park

Doo-Ri Song

Yun-Hee Baek

Yong-Jin Chung

Jin-Gyo Kim

Hiu-Chan Yun

A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.

Composition for forming silica layer, silica layer, and electronic device

A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group: 

Curable organo polysiloxane composition, encapsulant, and electronic device

Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si&#x2014;H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant.(RRRSiO)(RRSiO)(RRSiO)(RSiO&#x2014;Y&#x2014;SiOR)(RSiO)(RSiO)(RSiO)(SiO&#x2014;Y&#x2014;SiO)(SiO)&#x2003;&#x2003;[Chemical Formula 1] In the above Chemical Formula 1, Rto R, Y, Y, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Curable polysiloxane composition for optical device and encapsulant and optical device

Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si&#x2014;Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.

Composition for encapsulant, encapsulant, and electronic element

A resist underlayer composition and a method of manufacturing a semiconductor integrated circuit device, the composition including a solvent and an organosilane polymer, the organosilane polymer being a condensation polymerization product of at least one first compound represented by Chemical Formulae 1 and 2 and at least one second compound represented by Chemical Formulae 3 to 5.

Resist underlayer composition and method of manufacturing semiconductor integrated circuit device using the same

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si-Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

Resin for transparent encapsulation material, and associated encapsulation material and electronic device

A resist underlayer composition includes a solvent and an organosilane condensation polymerization product, the organosilane condensation polymerization product including about 40 to about 80 mol % of a structural unit represented by the following Chemical Formula 1, 

Resist underlayer composition and process of producing integrated circuit devices using the same

A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure, 

Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si&#x2014;Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si&#x2014;Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si&#x2014;Vi) in the second polysiloxane is about 1 to about 1.

A photoresist underlayer composition includes a solvent, and a polysiloxane resin represented by Chemical Formula 1:{(SiO&#x2014;Y&#x2014;SiO)(SiO)(XSiO)}(OH)(OR). &#x2003;&#x2003;[Chemical Formula 1]

Photoresist underlayer composition and method of manufacturing semiconductor device by using the same

A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2: 

Transparent resin for encapsulation material and electronic device including the same

A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2, 

Resin composition for transparent encapsulation material and electronic device formed using the same

A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure: 

Hybrid siloxane polymer, encapsulant obtained from the siloxane polymer, and electronic device including the encapsulant

Growing community of inventors

Uiwang-si, South Korea

Sang-Ran Koh